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MSP430F6436IPZR

Texas Instruments

MSP430F6436IPZR by Texas Instruments

MSP430F6436IPZR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 18 RAM words, and 2-Ch 12-Bit DAC channels. Ideal for industrial applications requiring low power consumption and high-speed processing. Features include 18 timers, DMA support, and various connectivity options like I2C and SPI.

Median Price

$5.056

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 29,260 parts In-Stock

1+ parts

$5.056

100+ parts

$4.122

1k+ parts

$2.748

10k+ parts

-

29,260

$5.056

$4.122

$2.748

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,727 parts In-Stock

1+ parts

$4.803

100+ parts

-

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-

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1,727

$4.803

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Vyrian

USA . 8,075 parts In-Stock

1+ parts

-

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8,075

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Chip Stock

USA . 3,000 parts In-Stock

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3,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,762 parts In-Stock

1+ parts

$4.550

100+ parts

-

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-

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3,762

$4.550

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AZTECH Wire

Italy . 1,008 parts In-Stock

1+ parts

$12.460

100+ parts

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1,008

$12.460

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Parana Technologies

USA . 710 parts In-Stock

1+ parts

$42.701

100+ parts

-

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710

$42.701

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DigiPath Technology Company

USA . 1,223 parts In-Stock

1+ parts

$47.019

100+ parts

$43.258

1k+ parts

-

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1,223

$47.019

$43.258

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IDEA Electronic Components Group

UK . 1,641 parts In-Stock

1+ parts

$47.979

100+ parts

$45.580

1k+ parts

$43.181

10k+ parts

-

1,641

$47.979

$45.580

$43.181

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ChromeModa Solutions

Germany . 382 parts In-Stock

1+ parts

$47.979

100+ parts

$39.343

1k+ parts

-

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382

$47.979

$39.343

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Overview

Unlock the full potential of your electronic projects with the MSP430F6436IPZR microcontroller from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments offers a wide range of applications for this device, making it the perfect choice for any project. With integrated cache, low power mode, and a variety of connectivity options, this microcontroller provides exceptional value and performance. Whether you're a hobbyist or a professional, the MSP430F6436IPZR will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product.

Integrated Cache: YES

Integrated cache helps in improving the speed and efficiency of the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage which can be beneficial for certain applications.

On Chip Data RAM Width: 8

A wider data RAM width allows for more efficient data processing.

ADC Channels: YES

Having ADC channels enables analog-to-digital conversion, which is useful for various sensor applications.

DMA Channels: YES

DMA channels help in offloading data transfer tasks from the CPU, improving overall system performance.

ROM Words: 131072

Large ROM size allows for storing a significant amount of program data.

Maximum Clock Frequency: 32 MHz

High clock frequency enables faster processing speeds for the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient processing and execution of instructions.

Analog To Digital Convertors: 16-Ch 12-Bit

Having multiple high-resolution ADC channels allows for accurate conversion of analog signals.

Connectivity: "I2C, IRDA, SCI, SPI(2), UART(2)

Multiple connectivity options enable seamless communication with other devices.

Technical Specifications

Microcontrollers MSP430F6436IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

RAM Words:

18

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI, SPI(2), UART(2)"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6436IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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