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MSP430F6435IZQWT

Texas Instruments

MSP430F6435IZQWT by Texas Instruments

MSP430F6435IZQWT by Texas Instruments is a 16-bit microcontroller with 262144 ROM words, 18 RAM words, and 16-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption and high-speed processing. Features include 6 DMA channels, 18 timers, and various connectivity options like I2C, SCI, SPI(2), UART(2).

Median Price

$5.942

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.942

10k+ parts

-

250

-

-

$5.942

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,337 parts In-Stock

1+ parts

-

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-

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7,337

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Digiode

USA . 3,689 parts In-Stock

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-

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3,689

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 240 parts In-Stock

1+ parts

$9.560

100+ parts

$7.150

1k+ parts

-

10k+ parts

-

240

$9.560

$7.150

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-

Microchip USA

USA . 288 parts In-Stock

1+ parts

$19.760

100+ parts

$19.480

1k+ parts

$19.340

10k+ parts

$19.200

288

$19.760

$19.480

$19.340

$19.200

Parana Technologies

USA . 2,377 parts In-Stock

1+ parts

$25.769

100+ parts

-

1k+ parts

$26.373

10k+ parts

-

2,377

$25.769

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$26.373

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DigiPath Technology Company

USA . 2,169 parts In-Stock

1+ parts

$28.375

100+ parts

$26.105

1k+ parts

-

10k+ parts

-

2,169

$28.375

$26.105

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ChromeModa Solutions

Germany . 5,441 parts In-Stock

1+ parts

$28.954

100+ parts

$23.742

1k+ parts

-

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5,441

$28.954

$23.742

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IDEA Electronic Components Group

UK . 692 parts In-Stock

1+ parts

$28.954

100+ parts

$27.506

1k+ parts

$26.059

10k+ parts

-

692

$28.954

$27.506

$26.059

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Corphita

USA . 854 parts In-Stock

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854

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Overview

Experience unparalleled performance and reliability with the Texas Instruments MSP430F6435IZQWT microcontroller. Crafted by a trusted industry leader, this device offers cutting-edge integrated cache capabilities and a wide range of peripherals for seamless connectivity. Ideal for industrial applications, this microcontroller boasts low power consumption and a compact design, making it the perfect solution for your next project. Unlock endless possibilities with the MSP430F6435IZQWT and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal and mechanical properties for the microcontroller, ensuring durability and reliability.

Integrated Cache: YES

Improves the performance of the microcontroller by storing frequently used instructions and data for quick access.

Maximum Supply Voltage: 3.6 V

Allows for a wider range of external power supply options, increasing flexibility in design.

Bit Size: 16

Offers a good balance between complexity and power consumption, suitable for various applications.

Maximum Operating Temperature: 85 °C

Ideal for industrial applications where the microcontroller may be exposed to higher temperatures.

ADC Channels: YES

Enables analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a reduced instruction set computing (RISC) architecture, offering high performance and low power consumption.

Technology: CMOS

Complementary metal-oxide-semiconductor technology provides low power consumption and high noise immunity.

Analog To Digital Convertors: 16-Ch 12-Bit

Offers versatile analog input capabilities with high resolution for precision measurement applications.

PWM Channels: YES

Supports pulse-width modulation output, crucial for controlling motors, LEDs, and other devices requiring variable power.

Technical Specifications

Microcontrollers MSP430F6435IZQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

113

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

RAM Words:

18

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI, SPI(2), UART(2)"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F6435IZQWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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