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MSP430F6435IPZR

Texas Instruments

MSP430F6435IPZR by Texas Instruments

MSP430F6435IPZR by Texas Instruments is a 16-bit microcontroller with 262144 ROM words, 18 RAM words, and 16-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption and high-speed processing. Features include integrated cache, DMA support, and multiple connectivity options like I2C and UART.

Median Price

$9.486

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,317 parts In-Stock

1+ parts

$6.933

100+ parts

$5.652

1k+ parts

$3.768

10k+ parts

-

4,317

$6.933

$5.652

$3.768

-

DigiKey

USA . 86 parts In-Stock

1+ parts

$12.040

100+ parts

$8.073

1k+ parts

$7.927

10k+ parts

-

86

$12.040

$8.073

$7.927

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,797 parts In-Stock

1+ parts

$6.586

100+ parts

-

1k+ parts

-

10k+ parts

-

4,797

$6.586

-

-

-

Vyrian

USA . 9,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,729

-

-

-

-

Chip Stock

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,635 parts In-Stock

1+ parts

$6.240

100+ parts

-

1k+ parts

-

10k+ parts

-

4,635

$6.240

-

-

-

Microchip USA

USA . 1,736 parts In-Stock

1+ parts

$30.950

100+ parts

$30.760

1k+ parts

$30.660

10k+ parts

$30.570

1,736

$30.950

$30.760

$30.660

$30.570

Parana Technologies

USA . 1,275 parts In-Stock

1+ parts

$70.312

100+ parts

-

1k+ parts

-

10k+ parts

-

1,275

$70.312

-

-

-

ChromeModa Solutions

Germany . 5,473 parts In-Stock

1+ parts

$79.002

100+ parts

$64.782

1k+ parts

-

10k+ parts

-

5,473

$79.002

$64.782

-

-

IDEA Electronic Components Group

UK . 1,519 parts In-Stock

1+ parts

$79.002

100+ parts

$75.052

1k+ parts

$71.102

10k+ parts

-

1,519

$79.002

$75.052

$71.102

-

DigiPath Technology Company

USA . 1,788 parts In-Stock

1+ parts

-

100+ parts

$71.228

1k+ parts

-

10k+ parts

-

1,788

-

$71.228

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-

Perfect Parts

USA . 634 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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634

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Overview

Experience the power of Texas Instruments with the MSP430F6435IPZR microcontroller. Designed with top-notch quality and cutting-edge technology, this device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller provides seamless integration and efficient operation. Trust in Texas Instruments to deliver premium products that exceed expectations and unlock endless possibilities. Elevate your projects with the MSP430F6435IPZR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the product.

Integrated Cache: YES

Integrated cache helps in improving the speed and efficiency of data retrieval and processing.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in powering the microcontroller.

On Chip Data RAM Width: 8

Wider data RAM width ensures efficient handling of data within the microcontroller.

Package Shape: SQUARE

Square package shape provides ease of mounting and efficient use of space on PCB.

Bit Size: 16

16-bit architecture allows for processing larger chunks of data at a time.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages provides flexibility in design and compatibility with different systems.

No. of Terminals: 100

Higher number of terminals allow for more connectivity options and peripherals to be interfaced with the microcontroller.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in harsh cold environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient processing of instructions and quick response times.

Technical Specifications

Microcontrollers MSP430F6435IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

RAM Words:

18

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI, SPI(2), UART(2)"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F6435IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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