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MSP430F6433IZCAT

Texas Instruments

MSP430F6433IZCAT by Texas Instruments

MSP430F6433IZCAT by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 5120 RAM words. It features 2-CH 12-BIT DAC, 16-Ch 12-Bit ADC, and operates at a max frequency of 32 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$10.364

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 500 parts In-Stock

1+ parts

$7.498

100+ parts

$6.113

1k+ parts

$4.075

10k+ parts

-

500

$7.498

$6.113

$4.075

-

Mouser Electronics

USA . 247 parts In-Stock

1+ parts

$13.230

100+ parts

$8.910

1k+ parts

$7.320

10k+ parts

-

247

$13.230

$8.910

$7.320

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,381 parts In-Stock

1+ parts

$7.123

100+ parts

-

1k+ parts

-

10k+ parts

-

3,381

$7.123

-

-

-

Vyrian

USA . 7,164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,164

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,281 parts In-Stock

1+ parts

$6.748

100+ parts

-

1k+ parts

-

10k+ parts

-

4,281

$6.748

-

-

-

Parana Technologies

USA . 917 parts In-Stock

1+ parts

$38.541

100+ parts

-

1k+ parts

-

10k+ parts

-

917

$38.541

-

-

-

DigiPath Technology Company

USA . 752 parts In-Stock

1+ parts

$42.439

100+ parts

$39.044

1k+ parts

-

10k+ parts

-

752

$42.439

$39.044

-

-

ChromeModa Solutions

Germany . 6,312 parts In-Stock

1+ parts

$43.305

100+ parts

$35.510

1k+ parts

-

10k+ parts

-

6,312

$43.305

$35.510

-

-

IDEA Electronic Components Group

UK . 14 parts In-Stock

1+ parts

$43.305

100+ parts

$41.140

1k+ parts

$38.974

10k+ parts

-

14

$43.305

$41.140

$38.974

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Discover the cutting-edge MSP430F6433IZCAT microcontroller by Texas Instruments, setting new standards in performance and reliability. With a wide range of applications in mind, this device offers unparalleled quality and value to customers looking for seamless integration and efficient operation. From its integrated cache to its advanced features, this microcontroller delivers exceptional benefits and advantages, making it the ideal choice for your next project. Trust Texas Instruments to provide top-of-the-line solutions that exceed expectations and drive innovation in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and suitable for a variety of environments.

Integrated Cache: YES

Having an integrated cache helps improve overall performance by reducing the access time to frequently used data and instructions.

Maximum Supply Voltage: 3.6 V

With a higher supply voltage, this microcontroller can handle more power-intensive tasks effectively.

On Chip Data RAM Width: 16

A wider data RAM width allows for faster data processing and storage capabilities for complex applications.

ADC Channels: YES

Having analog-to-digital converter channels enables the microcontroller to interface with various sensors and external devices.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller ensures efficient processing and control operations for optimized performance.

Maximum Clock Frequency: 32 MHz

A high clock frequency allows for quick execution of instructions and data processing tasks, making the microcontroller suitable for high-speed applications.

Technical Specifications

Microcontrollers MSP430F6433IZCAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

113

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

10240

RAM Words:

5120

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SCI, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-CH 12-BIT

Trade Compliance

MSP430F6433IZCAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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