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MSP430F6433IZCAR

Texas Instruments

MSP430F6433IZCAR by Texas Instruments

MSP430F6433IZCAR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 5120 RAM words. It features 2-CH 12-BIT DAC, 16-Ch 12-Bit ADC, and operates at a max frequency of 32 MHz. Ideal for industrial applications requiring low power consumption and high-performance computing capabilities.

Median Price

$6.249

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,500 parts In-Stock

1+ parts

$6.249

100+ parts

$5.094

1k+ parts

$3.396

10k+ parts

-

4,500

$6.249

$5.094

$3.396

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,457 parts In-Stock

1+ parts

$5.937

100+ parts

-

1k+ parts

-

10k+ parts

-

3,457

$5.937

-

-

-

Vyrian

USA . 6,151 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,151

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,325 parts In-Stock

1+ parts

$5.624

100+ parts

-

1k+ parts

-

10k+ parts

-

3,325

$5.624

-

-

-

AZTECH Wire

Italy . 933 parts In-Stock

1+ parts

$20.170

100+ parts

-

1k+ parts

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10k+ parts

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933

$20.170

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-

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Microchip USA

USA . 2,720 parts In-Stock

1+ parts

$28.980

100+ parts

$28.800

1k+ parts

$28.720

10k+ parts

$28.630

2,720

$28.980

$28.800

$28.720

$28.630

Parana Technologies

USA . 1,907 parts In-Stock

1+ parts

$61.536

100+ parts

-

1k+ parts

-

10k+ parts

-

1,907

$61.536

-

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DigiPath Technology Company

USA . 601 parts In-Stock

1+ parts

$67.759

100+ parts

$62.338

1k+ parts

-

10k+ parts

-

601

$67.759

$62.338

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-

ChromeModa Solutions

Germany . 6,071 parts In-Stock

1+ parts

$69.142

100+ parts

$56.696

1k+ parts

-

10k+ parts

-

6,071

$69.142

$56.696

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IDEA Electronic Components Group

UK . 998 parts In-Stock

1+ parts

$69.142

100+ parts

$65.685

1k+ parts

$62.228

10k+ parts

-

998

$69.142

$65.685

$62.228

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

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Overview

Enhance your product designs with the Texas Instruments MSP430F6433IZCAR microcontroller, a high-quality solution known for its reliability and efficiency. This versatile device offers integrated cache, low power mode, and a wide range of peripherals including DAC and ADC channels. Ideal for industrial applications, this microcontroller boasts a maximum clock frequency of 32 MHz and operates in temperatures ranging from -40°C to 85°C. Trust in Texas Instruments' reputation for excellence and unlock the full potential of your projects with the MSP430F6433IZCAR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache helps improve processing speed and efficiency, making the product ideal for handling complex tasks.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a variety of power requirements, providing flexibility in design.

On Chip Data RAM Width: 16

The 16-bit data RAM width allows for efficient data processing and storage, enhancing the overall performance of the product.

DAC Channels: YES

Having DAC channels allows for analog output capabilities, making the microcontroller suitable for applications requiring precise voltage or current control.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures efficient processing of instructions, resulting in faster operation and improved performance.

Connectivity: I2C, IRDA, SCI, SPI(2), UART(2)

The various connectivity options provided make it versatile and compatible with a wide range of communication protocols, enhancing its usability in diverse applications.

Technical Specifications

Microcontrollers MSP430F6433IZCAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

113

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

10240

RAM Words:

5120

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SCI, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-CH 12-BIT

Trade Compliance

MSP430F6433IZCAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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