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MSP430F6433IPZ

Texas Instruments

MSP430F6433IPZ by Texas Instruments

MSP430F6433IPZ by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 10 RAM words, and 16-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features 18 timers, DMA support for efficient data transfer, and various connectivity options like I2C and UART.

Median Price

$6.968

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,080 parts In-Stock

1+ parts

$6.968

100+ parts

$5.681

1k+ parts

$3.787

10k+ parts

-

3,080

$6.968

$5.681

$3.787

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 882 parts In-Stock

1+ parts

$6.620

100+ parts

-

1k+ parts

-

10k+ parts

-

882

$6.620

-

-

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Vyrian

USA . 6,345 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

6,345

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,182 parts In-Stock

1+ parts

$6.271

100+ parts

-

1k+ parts

-

10k+ parts

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1,182

$6.271

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-

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Parana Technologies

USA . 159 parts In-Stock

1+ parts

$18.878

100+ parts

-

1k+ parts

$18.953

10k+ parts

-

159

$18.878

-

$18.953

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DigiPath Technology Company

USA . 938 parts In-Stock

1+ parts

$20.787

100+ parts

$19.124

1k+ parts

-

10k+ parts

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938

$20.787

$19.124

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AZTECH Wire

Italy . 784 parts In-Stock

1+ parts

$21.190

100+ parts

-

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10k+ parts

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784

$21.190

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ChromeModa Solutions

Germany . 5,836 parts In-Stock

1+ parts

$21.211

100+ parts

$17.393

1k+ parts

-

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5,836

$21.211

$17.393

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IDEA Electronic Components Group

UK . 640 parts In-Stock

1+ parts

$21.211

100+ parts

$20.150

1k+ parts

$19.090

10k+ parts

-

640

$21.211

$20.150

$19.090

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Lixinc

USA . 14,930 parts In-Stock

1+ parts

-

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14,930

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GreenTree Electronics

Israel . 750 parts In-Stock

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750

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Overview

Discover the innovative MSP430F6433IPZ by Texas Instruments, a high-quality microcontroller that offers unmatched performance and reliability. With integrated cache and a wide range of peripherals, this product is perfect for a variety of applications. From industrial automation to consumer electronics, this microcontroller provides value and flexibility. Experience the benefits of low power consumption, fast processing speeds, and seamless connectivity with the MSP430F6433IPZ. Trust in Texas Instruments' reputation for excellence and unlock endless possibilities with this cutting-edge technology. Elevate your projects with the MSP430F6433IPZ today.

Feature Benefit Bullets

Integrated Cache: YES

Having integrated cache helps in improving the performance by reducing memory access times and increasing data throughput.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and support for various applications.

Bit Size: 16

Having a 16-bit architecture provides enhanced processing capabilities and efficiency compared to lower bit sizes.

Maximum Clock Frequency: 32 MHz

Higher clock frequency enables faster processing and execution of instructions, making the product suitable for tasks requiring quick response times.

Analog To Digital Convertors: 16-Ch 12-Bit

Having 16 analog to digital converters with 12-bit resolution each allows for accurate and high-quality signal conversion, which is essential for many applications.

Connectivity: "I2C, IRDA, SCI, SPI(2), UART(2)

Multiple connectivity options provided by different communication protocols enable seamless integration with other devices and systems.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures efficient instruction execution and optimal performance for a wide range of applications.

Low Power Mode: YES

The availability of low power mode helps in reducing power consumption when the product is idle or operating under low processing requirements, leading to energy efficiency.

Technical Specifications

Microcontrollers MSP430F6433IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

RAM Words:

10

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI, SPI(2), UART(2)"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F6433IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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