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MSP430F5658IPZR

Texas Instruments

MSP430F5658IPZR by Texas Instruments

MSP430F5658IPZR by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 32MHz max clock frequency, and 16-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features BOR, PWM, RTC, and UART connectivity options in a compact square package.

Median Price

$8.924

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,320 parts In-Stock

1+ parts

$8.924

100+ parts

$7.795

1k+ parts

$5.376

10k+ parts

-

3,320

$8.924

$7.795

$5.376

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,429 parts In-Stock

1+ parts

$8.478

100+ parts

-

1k+ parts

-

10k+ parts

-

2,429

$8.478

-

-

-

Vyrian

USA . 4,014 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,014

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,623 parts In-Stock

1+ parts

$8.032

100+ parts

-

1k+ parts

-

10k+ parts

-

1,623

$8.032

-

-

-

AZTECH Wire

Italy . 248 parts In-Stock

1+ parts

$15.210

100+ parts

-

1k+ parts

-

10k+ parts

-

248

$15.210

-

-

-

Microchip USA

USA . 2,424 parts In-Stock

1+ parts

$20.220

100+ parts

$19.930

1k+ parts

$19.790

10k+ parts

$19.640

2,424

$20.220

$19.930

$19.790

$19.640

Parana Technologies

USA . 1,399 parts In-Stock

1+ parts

$47.854

100+ parts

$4,443.925

1k+ parts

$43.068

10k+ parts

-

1,399

$47.854

$4,443.925

$43.068

-

DigiPath Technology Company

USA . 1,828 parts In-Stock

1+ parts

$52.693

100+ parts

-

1k+ parts

-

10k+ parts

-

1,828

$52.693

-

-

-

ChromeModa Solutions

Germany . 673 parts In-Stock

1+ parts

$53.768

100+ parts

$44.090

1k+ parts

-

10k+ parts

-

673

$53.768

$44.090

-

-

IDEA Electronic Components Group

UK . 656 parts In-Stock

1+ parts

$53.768

100+ parts

$51.080

1k+ parts

$48.391

10k+ parts

-

656

$53.768

$51.080

$48.391

-

Overview

Unleash the power of innovation with the MSP430F5658IPZR by Texas Instruments, a cutting-edge microcontroller designed to revolutionize your projects. With Texas Instruments' renowned quality and expertise in manufacturing, this device offers unparalleled performance and reliability in various applications. Experience seamless connectivity, low power consumption, and advanced features that guarantee optimal functionality. Elevate your designs and achieve remarkable results with the MSP430F5658IPZR, the ultimate choice for discerning customers seeking top-notch technology solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the package, making it suitable for various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Ability to handle a maximum supply voltage of 3.6V provides flexibility and compatibility with different power sources.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easier layout design.

Bit Size: 16

16-bit architecture offers high processing capability and performance for tasks that require complex calculations.

DAC Channels: YES

DAC channels enable the generation of analog signals, vital for applications requiring precise control over analog outputs.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) enhances compatibility and flexibility in system design and integration.

No. of Terminals: 100

Having 100 terminals allows for sufficient connectivity options and interfaces for connecting external components and peripherals.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish ensures robust and reliable connections, reducing the risk of corrosion and signal degradation.

ADC Channels: YES

Presence of ADC channels enables the conversion of analog signals into digital data, essential for tasks involving analog input processing.

DMA Channels: YES

DMA channels facilitate direct memory access, improving data transfer efficiency and reducing CPU workload for enhanced system performance.

ROM Words: 393216

Large ROM capacity of 393216 words allows for storing significant amounts of program code and data, suitable for complex applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance, low power consumption, and efficient code execution for a wide range of applications.

RAM Bytes: 32768

Ample RAM capacity of 32768 bytes provides enough memory for data storage and manipulation, enhancing the execution speed and efficiency of tasks.

Technology: CMOS

CMOS technology ensures low power consumption, high noise immunity, and reliable operation, making it a suitable choice for energy-efficient designs.

Analog To Digital Convertors: 16-Ch 12-Bit

16-channel, 12-bit ADC allows for precise and simultaneous conversion of multiple analog signals, suitable for applications requiring high-resolution measurements.

No. of Serial I/Os: 2

Having 2 serial I/Os provides versatile communication options, enabling connectivity with external devices and peripherals for data exchange.

PWM Channels: YES

Presence of PWM channels allows for accurate control of pulse-width modulation signals, essential for tasks like motor control and LED dimming.

Connectivity: I2C(3), IRDA(3), SPI(6), UART(3), USB

Multiple connectivity options such as I2C, IRDA, SPI, UART, and USB facilitate seamless integration with various communication protocols and interfaces.

No. of Timers: 4

Having 4 timers enables precise timing and scheduling of tasks, essential for applications requiring synchronized operations and event handling.

Technical Specifications

Microcontrollers MSP430F5658IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ, ALSO HAVING ADDITIONAL 2KB SRAM WHEN USB NOT IN USE

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

74

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

0

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F5658IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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