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MSP430F5635IZQWT

Texas Instruments

MSP430F5635IZQWT by Texas Instruments

MSP430F5635IZQWT by Texas Instruments is a 16-bit microcontroller with 262144 ROM words, 18432 RAM bytes, and 16 ADC channels. Ideal for industrial applications due to its low power mode, connectivity options (I2C, IRDA, SPI, UART), and peripheral support including BOR, DMA(6), RTC.

Median Price

$4.240

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,750 parts In-Stock

1+ parts

$4.240

100+ parts

$4.160

1k+ parts

$4.070

10k+ parts

-

1,750

$4.240

$4.160

$4.070

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,643 parts In-Stock

1+ parts

$4.028

100+ parts

-

1k+ parts

-

10k+ parts

-

2,643

$4.028

-

-

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Vyrian

USA . 3,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,170

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,799 parts In-Stock

1+ parts

$3.816

100+ parts

-

1k+ parts

-

10k+ parts

-

3,799

$3.816

-

-

-

Parana Technologies

USA . 1,892 parts In-Stock

1+ parts

$15.514

100+ parts

-

1k+ parts

$15.889

10k+ parts

-

1,892

$15.514

-

$15.889

-

DigiPath Technology Company

USA . 1,709 parts In-Stock

1+ parts

$17.082

100+ parts

$15.716

1k+ parts

-

10k+ parts

-

1,709

$17.082

$15.716

-

-

IDEA Electronic Components Group

UK . 1,497 parts In-Stock

1+ parts

$17.431

100+ parts

$16.559

1k+ parts

$15.688

10k+ parts

-

1,497

$17.431

$16.559

$15.688

-

ChromeModa Solutions

Germany . 1,173 parts In-Stock

1+ parts

$17.431

100+ parts

$14.293

1k+ parts

-

10k+ parts

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1,173

$17.431

$14.293

-

-

AZTECH Wire

Italy . 321 parts In-Stock

1+ parts

$21.320

100+ parts

-

1k+ parts

-

10k+ parts

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321

$21.320

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QUARKTWIN TECHNOLOGY LTD

USA . 16,091 parts In-Stock

1+ parts

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16,091

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Microchip USA

USA . 415 parts In-Stock

1+ parts

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415

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Overview

Experience the power and efficiency of Texas Instruments with the MSP430F5635IZQWT microcontroller. Perfect for a wide range of applications, this product offers high-quality performance and reliability. With advanced features such as multiple timers, PWM channels, and connectivity options, it provides unparalleled value to customers seeking top-notch functionality in a compact package. Trust Texas Instruments to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for easy integration onto printed circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

This high maximum supply voltage allows for flexibility in power supply options.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width allows for faster data processing and storage.

Bit Size: 16

A 16-bit architecture provides higher precision and performance compared to lower bit sizes.

Power Supplies (V): 2/3.3

This microcontroller supports dual power supply options for versatility in different applications.

No. of Terminals: 113

Having a high number of terminals allows for more connectivity options and interfaces.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers compact size, high density, and enhanced electrical performance.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures efficient power consumption and operation in low power scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it ideal for battery-operated devices.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and solderability for reliable connections.

ADC Channels: YES

Having analog-to-digital converter channels enables the microcontroller to process and analyze analog signals.

DMA Channels: YES

Direct memory access channels improve data transfer speeds and efficiency.

RAM Words: 16

The on-chip RAM capacity of 16 words allows for efficient data storage and retrieval.

Peripheral IC Type: MICROCONTROLLER, RISC

A reduced instruction set computing (RISC) architecture enhances the microcontroller's performance and energy efficiency.

No. of Timers: 4

Multiple timers enable precise timing control for various functions and tasks.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this microcontroller meets the rugged environmental requirements of industrial applications.

No. of Serial I/Os: 4

Having multiple serial I/O interfaces allows for easy communication with external devices.

Technical Specifications

Microcontrollers MSP430F5635IZQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

113

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F5635IZQWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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