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MSP430F5635IPZR

Texas Instruments

MSP430F5635IPZR by Texas Instruments

MSP430F5635IPZR by Texas Instruments is a 16-bit microcontroller with 262144 ROM words and 16384 RAM bytes. It features 16-Ch 12-Bit ADC channels, 6 DMA channels, and operates at a max clock frequency of 32 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$8.288

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 45,340 parts In-Stock

1+ parts

$6.977

100+ parts

$5.688

1k+ parts

$3.792

10k+ parts

-

45,340

$6.977

$5.688

$3.792

-

Mouser Electronics

USA . 1,000 parts In-Stock

1+ parts

$9.600

100+ parts

$8.820

1k+ parts

$6.570

10k+ parts

-

1,000

$9.600

$8.820

$6.570

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$5.375

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$5.375

-

-

-

Digiode

USA . 2,231 parts In-Stock

1+ parts

$6.628

100+ parts

-

1k+ parts

-

10k+ parts

-

2,231

$6.628

-

-

-

Vyrian

USA . 2,186 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,186

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$5.268

100+ parts

-

1k+ parts

$5.057

10k+ parts

-

2,000

$5.268

-

$5.057

-

Ampacity Inc.

Singapore . 22,990 parts In-Stock

1+ parts

$5.930

100+ parts

-

1k+ parts

-

10k+ parts

-

22,990

$5.930

-

-

-

Corphita

USA . 4,813 parts In-Stock

1+ parts

$6.279

100+ parts

-

1k+ parts

-

10k+ parts

-

4,813

$6.279

-

-

-

Parana Technologies

USA . 1,753 parts In-Stock

1+ parts

$54.363

100+ parts

-

1k+ parts

-

10k+ parts

-

1,753

$54.363

-

-

-

DigiPath Technology Company

USA . 282 parts In-Stock

1+ parts

$59.860

100+ parts

-

1k+ parts

-

10k+ parts

-

282

$59.860

-

-

-

ChromeModa Solutions

Germany . 958 parts In-Stock

1+ parts

$61.082

100+ parts

$50.087

1k+ parts

-

10k+ parts

-

958

$61.082

$50.087

-

-

IDEA Electronic Components Group

UK . 131 parts In-Stock

1+ parts

$61.082

100+ parts

$58.028

1k+ parts

$54.974

10k+ parts

-

131

$61.082

$58.028

$54.974

-

Lixinc

USA . 16,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,796

-

-

-

-

Benley Electronics

USA . 1,019 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,019

-

-

-

-

Overview

Elevate your projects with the MSP430F5635IPZR by Texas Instruments, a top-tier microcontroller designed for optimal performance and reliability. With a wide range of peripherals including BOR, RTC, and DMA, this device offers unparalleled versatility for various applications. The advanced technology and industrial-grade quality ensure seamless operation even in challenging environments. Experience the power of innovation with the MSP430F5635IPZR, where cutting-edge features meet outstanding value for customers seeking high-quality solutions. Upgrade your projects today and unlock endless possibilities with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V enables compatibility with a wide range of power sources.

On Chip Data RAM Width: 8

Having an on-chip data RAM width of 8 bits allows for efficient data processing and storage.

Package Shape: SQUARE

Square package shape aids in space-saving and efficient PCB layout design.

Bit Size: 16

16-bit architecture enables higher computational capabilities and performance.

Power Supplies (V): 2/3.3

Support for multiple power supply options (2V and 3.3V) offers flexibility in powering the device.

No. of Terminals: 100

Having 100 terminals provides a wide range of connectivity options for interfacing with external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances thermal performance and improves signal integrity.

Minimum Supply Voltage: 2.4 V

Support for a minimum supply voltage of 2.4V ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments.

CPU Family: MSP430

Being part of the MSP430 family signifies efficiency, low power consumption, and high performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes it suitable for use in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent corrosion resistance and conductivity for reliable connections.

ADC Channels: YES

Having ADC channels enables analog-to-digital conversion for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels support direct memory access for faster data transfers and efficient performance.

Technical Specifications

Microcontrollers MSP430F5635IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F5635IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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