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MSP430F5633IPZ

Texas Instruments

MSP430F5633IPZ by Texas Instruments

MSP430F5633IPZ by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It features 16-Ch 12-Bit ADC channels, 6 DMA channels, and operates at a max clock frequency of 32 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$7.047

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,700 parts In-Stock

1+ parts

$7.047

100+ parts

$5.745

1k+ parts

$3.830

10k+ parts

-

3,700

$7.047

$5.745

$3.830

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,069 parts In-Stock

1+ parts

$6.695

100+ parts

-

1k+ parts

-

10k+ parts

-

1,069

$6.695

-

-

-

Vyrian

USA . 8,658 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,658

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,540 parts In-Stock

1+ parts

$6.342

100+ parts

-

1k+ parts

-

10k+ parts

-

2,540

$6.342

-

-

-

Microchip USA

USA . 2,615 parts In-Stock

1+ parts

$19.280

100+ parts

$19.000

1k+ parts

$18.870

10k+ parts

$18.730

2,615

$19.280

$19.000

$18.870

$18.730

AZTECH Wire

Italy . 1,126 parts In-Stock

1+ parts

$20.090

100+ parts

-

1k+ parts

-

10k+ parts

-

1,126

$20.090

-

-

-

Parana Technologies

USA . 1,145 parts In-Stock

1+ parts

$57.523

100+ parts

-

1k+ parts

-

10k+ parts

-

1,145

$57.523

-

-

-

DigiPath Technology Company

USA . 1,276 parts In-Stock

1+ parts

$63.340

100+ parts

$58.273

1k+ parts

-

10k+ parts

-

1,276

$63.340

$58.273

-

-

ChromeModa Solutions

Germany . 5,835 parts In-Stock

1+ parts

$64.633

100+ parts

$52.999

1k+ parts

-

10k+ parts

-

5,835

$64.633

$52.999

-

-

IDEA Electronic Components Group

UK . 2,297 parts In-Stock

1+ parts

$64.633

100+ parts

$61.401

1k+ parts

$58.170

10k+ parts

-

2,297

$64.633

$61.401

$58.170

-

Overview

Unlock the power of innovation with the MSP430F5633IPZ by Texas Instruments, a cutting-edge microcontroller that offers unparalleled quality and reliability. Designed by a trusted manufacturer, this product is perfect for a wide range of applications in various industries. Experience the exceptional value and benefits of this device, from its high-performance capabilities to its low power consumption. Stay ahead of the competition and elevate your projects with the advantages that the MSP430F5633IPZ has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this microcontroller lightweight and durable, ideal for portable and rugged applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this microcontroller can operate efficiently in various industrial environments without overheating.

CPU Family: MSP430

Being part of the MSP430 CPU family ensures compatibility with a wide range of development tools and software, making it easier for developers to work with the microcontroller.

ADC Channels: YES

The availability of ADC channels allows the microcontroller to interface with analog sensors and devices, expanding its range of applications in data acquisition and processing.

Peripheral IC Type: MICROCONTROLLER, RISC

With RISC architecture, this microcontroller offers high performance processing capabilities while consuming low power, making it suitable for energy-efficient applications.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2), USB

The multiple connectivity options such as I2C, IRDA, SPI, UART, and USB enhance the communication capabilities of the microcontroller, enabling seamless integration with various devices and systems.

Technical Specifications

Microcontrollers MSP430F5633IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V SUPPLY AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA(2), SPI(4), UART(2), USB"

Peripherals:

"BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F5633IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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