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MSP430F5632IPZR

Texas Instruments

MSP430F5632IPZR by Texas Instruments

MSP430F5632IPZR by Texas Instruments is a 16-bit microcontroller with 262144 ROM words, 16384 RAM bytes, and 32 MHz max clock frequency. Ideal for industrial applications requiring low power consumption, it features peripherals like BOR, DMA, LCD, RTC, and USB connectivity.

Median Price

$6.977

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,220 parts In-Stock

1+ parts

$6.977

100+ parts

$5.688

1k+ parts

$3.792

10k+ parts

-

4,220

$6.977

$5.688

$3.792

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,789 parts In-Stock

1+ parts

$6.628

100+ parts

-

1k+ parts

-

10k+ parts

-

4,789

$6.628

-

-

-

Vyrian

USA . 4,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,622

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,932 parts In-Stock

1+ parts

$6.279

100+ parts

-

1k+ parts

-

10k+ parts

-

3,932

$6.279

-

-

-

AZTECH Wire

Italy . 455 parts In-Stock

1+ parts

$12.920

100+ parts

-

1k+ parts

-

10k+ parts

-

455

$12.920

-

-

-

Component Stockers USA

USA . 831 parts In-Stock

1+ parts

$63.490

100+ parts

-

1k+ parts

-

10k+ parts

-

831

$63.490

-

-

-

Parana Technologies

USA . 1,190 parts In-Stock

1+ parts

$75.087

100+ parts

$6,972.933

1k+ parts

$67.578

10k+ parts

-

1,190

$75.087

$6,972.933

$67.578

-

DigiPath Technology Company

USA . 1,031 parts In-Stock

1+ parts

$82.680

100+ parts

$76.065

1k+ parts

-

10k+ parts

-

1,031

$82.680

$76.065

-

-

IDEA Electronic Components Group

UK . 1,551 parts In-Stock

1+ parts

$84.367

100+ parts

$80.149

1k+ parts

$75.930

10k+ parts

-

1,551

$84.367

$80.149

$75.930

-

ChromeModa Solutions

Germany . 1,309 parts In-Stock

1+ parts

$84.367

100+ parts

$69.181

1k+ parts

-

10k+ parts

-

1,309

$84.367

$69.181

-

-

Overview

Discover the cutting-edge MSP430F5632IPZR microcontroller by Texas Instruments, setting the standard for quality and innovation in the industry. With a wide range of applications in mind, this powerful device boasts impressive performance and reliability. From its high-speed processing capabilities to its low power consumption, customers can trust in the value and benefits that this product offers. Unlock new possibilities with the MSP430F5632IPZR and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the microcontroller from external elements, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient integration on PCBs, saving space and making the assembly process simpler.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply requirements and allows for compatibility with a wide range of applications.

On Chip Data RAM Width: 8

Offers sufficient memory for faster data processing and multitasking capabilities.

Bit Size: 16

Enables handling of larger data sizes and complex calculations efficiently.

Power Supplies (V): 2/3.3

Supports multiple power supply options, giving users flexibility in designing their systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact design, optimal for space-constrained applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme low-temperature environments, making it suitable for a diverse range of applications.

ADC Channels: YES

Allows for analog to digital conversion, enabling measurement of real-world signals.

DMA Channels: YES

Facilitates direct memory access for efficient data transfer, reducing CPU workload.

ROM Words: 262144

Provides ample storage for program code, configurations, and data, accommodating complex embedded systems.

Maximum Clock Frequency: 32 MHz

Offers high processing speed for real-time operation and rapid response to input signals.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a reduced instruction set computing (RISC) architecture for efficient execution of instructions and streamlined operation.

Connectivity: 'I2C(2), IRDA(2), SPI(4), UART(2), USB'

Supports a variety of communication protocols, enhancing compatibility with external devices and networks.

Low Power Mode: YES

Enables energy-efficient operation, prolonging battery life and reducing power consumption.

Technical Specifications

Microcontrollers MSP430F5632IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V SUPPLY AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA(2), SPI(4), UART(2), USB"

Peripherals:

"BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT"

Trade Compliance

MSP430F5632IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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