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MSP430F5528IZQER

Texas Instruments

MSP430F5528IZQER by Texas Instruments

MSP430F5528IZQER by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 8192 RAM bytes. It features 10-Ch 12-Bit ADC channels, 4 timers, and connectivity options like I2C, SPI, UART, USB. Ideal for industrial applications requiring low power consumption and high-speed processing up to 32 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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ACDS - Activité Composants Distribution Service

France . 5,000 parts In-Stock

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Vyrian

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Chip Stock

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Digiode

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Cyclops Electronics Ltd

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Nova Conductors

Japan . 650 parts In-Stock

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Contempo Components LLC

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Distributors (Availability)

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AZTECH Wire

Italy . 535 parts In-Stock

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$14.403

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Ampacity Inc.

Singapore . 521 parts In-Stock

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$18.000

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One Stop Electronics

USA . 1,078 parts In-Stock

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$19.000

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Corohmni

South Africa . 226 parts In-Stock

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$19.256

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Parana Technologies

USA . 1,547 parts In-Stock

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$21.920

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Semicontronic

India . 413 parts In-Stock

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$22.000

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$21.450

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ChromeModa Solutions

Germany . 3,003 parts In-Stock

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$24.195

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$19.840

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IDEA Electronic Components Group

UK . 568 parts In-Stock

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$24.195

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$22.985

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$21.776

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$37.178

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Lixinc

USA . 14,953 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

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Corphita

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Authorized Procurement Solutions

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GreenTree Electronics

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DigiPath Technology Company

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Kepictronics

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Argo Parts USA

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Microchip USA

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Bastille Electronics

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Lucentia Tech

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F5528IZQER microcontroller. Known for its top-notch quality and reliability, Texas Instruments delivers a game-changing product that is versatile and powerful. Ideal for a wide range of applications, this microcontroller offers customers unmatched value and benefits. Experience seamless connectivity, low power consumption, and high performance with the MSP430F5528IZQER. Elevate your projects to new heights with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Max Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables compact and space-saving designs, making it suitable for projects with limited board space.

ADC Channels: YES

Integration of Analog to Digital Converters simplifies analog signal processing tasks and expands functionality.

Maximum Clock Frequency: 32 MHz

Provides high processing speeds, enhancing overall performance and responsiveness of the microcontroller.

Connectivity: I2C(2), SPI(4), UART(2), USB

Versatile communication options allow for seamless connectivity with a variety of external devices and peripherals.

ROM Programmability: FLASH

Flash programmable memory offers flexibility in updating firmware and software, ensuring adaptability to changing requirements.

Low Power Mode: YES

Efficient power management capabilities help optimize energy consumption and extend battery life, making it ideal for low-power applications.

Technical Specifications

Microcontrollers MSP430F5528IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), SPI(4), UART(2), USB"

Peripherals:

"COMPARATOR(8), RTC, TIMER(4)"

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430F5528IZQER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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