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MSP430F5528IRGC

Texas Instruments

MSP430F5528IRGC by Texas Instruments

MSP430F5528IRGC by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 8192 RAM bytes. It operates at a max clock frequency of 25 MHz, suitable for industrial applications requiring high-speed processing. With 47 I/O lines and PWM channels, it offers versatile connectivity options in a compact chip carrier package.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 7,500 parts In-Stock

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Vyrian

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Digiode

USA . 4,081 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Semicontronic

India . 287 parts In-Stock

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$6.000

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$5.850

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$5.820

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One Stop Electronics

USA . 224 parts In-Stock

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AZTECH Wire

Italy . 794 parts In-Stock

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$11.864

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Ampacity Inc.

Singapore . 780 parts In-Stock

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$13.000

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Corohmni

South Africa . 65 parts In-Stock

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$26.591

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Parana Technologies

USA . 647 parts In-Stock

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$67.442

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DigiPath Technology Company

USA . 1,307 parts In-Stock

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$74.261

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IDEA Electronic Components Group

UK . 1,888 parts In-Stock

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$75.777

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$71.988

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$68.199

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ChromeModa Solutions

Germany . 828 parts In-Stock

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$75.777

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$62.137

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$80.389

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$76.370

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Continental Prestige Electronics

USA . 4,682 parts In-Stock

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Lixinc

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Argo Parts USA

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Corphita

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A-Z Elektronik GmbH

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Bastille Electronics

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Robosynatics

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Lucentia Tech

USA . 500 parts In-Stock

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Microchip USA

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Overview

Elevate your projects with the Texas Instruments MSP430F5528IRGC microcontroller, a top-of-the-line solution handcrafted for excellence. This innovative chip offers unrivaled quality and reliability, backed by the esteemed reputation of Texas Instruments. Perfect for a wide range of applications, this microcontroller boasts advanced features and superior performance that will take your designs to the next level. With its cutting-edge technology and robust capabilities, the MSP430F5528IRGC provides exceptional value, benefits, and advantages that will exceed your expectations. Upgrade your projects today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

Ability to operate at higher supply voltages provides flexibility in design and compatibility with a wide range of power sources.

Package Shape: SQUARE

Square shape simplifies layout design and ensures efficient use of space on the PCB.

Bit Size: 16

16-bit architecture enables faster processing speeds and greater computational capabilities compared to lower bit sizes.

Power Supplies (V): 2/3.3

Compatibility with multiple power supply voltages allows for versatile usage in various electronic systems.

No. of Terminals: 64

High number of terminals provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Assortment of package styles offers flexibility in mounting options and thermal management for optimal performance.

Minimum Supply Voltage: 2.4 V

Low minimum supply voltage ensures energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

High operating temperature range allows the microcontroller to function reliably in harsh environmental conditions.

CPU Family: MSP430

MSP430 family is known for low power consumption and high performance, making it ideal for energy-efficient applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the microcontroller can operate in extreme cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, expanding the microcontroller's capabilities in data acquisition applications.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: QUAD

Quad terminal position simplifies soldering and PCB layout, facilitating easy integration into electronic circuits.

ROM Words: 131072

Large ROM capacity allows for storing extensive program code and data, catering to complex application requirements.

Maximum Seated Height: 1 mm

Low profile design with minimal seated height ensures compatibility with slim and compact electronic devices.

Width: 9 mm

Narrow width profile saves space on the PCB and allows for more efficient component placement.

Maximum Clock Frequency: 25 MHz

High clock frequency enables rapid data processing and execution of instructions, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time allows for proper soldering and bonding of the microcontroller during manufacturing.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures reliable solder joints and prevents component damage during assembly.

Length: 9 mm

Compact length dimension allows for a smaller footprint on the PCB, optimizing board space utilization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating guarantees reliable operation in rugged environments and industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution and reduced power consumption, enhancing the microcontroller's performance.

RAM Bytes: 8192

Ample RAM capacity provides sufficient memory for data storage and processing, supporting multitasking and efficient operation.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance, making it suitable for various applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures compatibility with RoHS standards.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage simplifies power management and ensures consistent performance of the microcontroller.

PWM Channels: YES

Built-in PWM channels enable precise control of analog signals and motor speed, essential for motor control and power management.

ROM Programmability: FLASH

Flash ROM technology allows for easy and fast programming of firmware updates, enhancing the microcontroller's flexibility and versatility.

Terminal Pitch: 0.5 mm

Fine pitch spacing allows for high-density interconnects and miniaturization of the PCB design, saving space and enabling compact devices.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates moderate moisture sensitivity, ensuring proper handling and storage procedures to prevent component damage.

Speed: 25 rpm

High speed capability enables rapid data processing and execution of tasks, improving overall system performance and responsiveness.

No. of I/O Lines: 47

Abundance of I/O lines provides comprehensive connectivity options for interfacing with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers MSP430F5528IRGC attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

47

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

MSP430F5528IRGC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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