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MSP430F5526IZQE

Texas Instruments

MSP430F5526IZQE by Texas Instruments

MSP430F5526IZQE by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 32 MHz. It features 10-Ch 12-Bit ADCs, 4 timers, and low power mode ideal for industrial applications requiring high-speed processing and connectivity via I2C, SPI, UART, and USB interfaces.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 5,423 parts In-Stock

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Component Sense

UK . 2,925 parts In-Stock

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Chip Stock

USA . 311 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 599 parts In-Stock

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$5.259

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One Stop Electronics

USA . 1,621 parts In-Stock

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$19.000

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Parana Technologies

USA . 889 parts In-Stock

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$30.489

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$69.129

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DigiPath Technology Company

USA . 542 parts In-Stock

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$33.572

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$30.886

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IDEA Electronic Components Group

UK . 1,087 parts In-Stock

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$34.257

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$32.544

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$30.831

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ChromeModa Solutions

Germany . 979 parts In-Stock

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$34.257

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$28.091

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Corphita

USA . 1,019 parts In-Stock

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Microchip USA

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Overview

Unleash the power of innovation with the MSP430F5526IZQE by Texas Instruments, a top-of-the-line microcontroller that embodies quality and reliability. Perfect for a wide range of applications, this product offers unparalleled value and benefits to customers looking for cutting-edge technology. With features like low power mode, multiple peripherals, and high-speed connectivity options, the MSP430F5526IZQE is guaranteed to take your projects to the next level. Choose Texas Instruments for superior performance and unlock endless possibilities with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protects the internal components of the microcontroller.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and making assembly simpler.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, making it versatile for a variety of applications.

On Chip Data RAM Width: 8

Provides good memory storage capacity for processing data efficiently.

Package Shape: SQUARE

Helps in uniform and efficient PCB layout design.

Bit Size: 16

Offers a good balance between processing power and energy efficiency.

Power Supplies (V): 2/3.3

Supports multiple voltage inputs, enabling flexibility in power management.

No. of Terminals: 80

Offers a wide range of connectivity options for peripherals and external components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enhances the overall performance and reliability of the microcontroller.

Minimum Supply Voltage: 2.4 V

Allows for operation even in low voltage conditions, enhancing versatility.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

CPU Family: MSP430

From a well-known and reliable manufacturer, ensuring high quality and performance.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it suitable for various environments.

ADC Channels: YES

Allows for analog to digital conversion, essential for many sensor and input applications.

DMA Channels: YES

Enables efficient data transfer and processing, improving overall system performance.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and reliability for electrical connections.

ROM Words: 98304

Offers ample storage capacity for program code and data.

Maximum Seated Height: 1 mm

Compact size allows for installation in space-constrained applications.

RAM Words: 6

Sufficient memory for temporary data storage and processing.

Width: 5 mm

Compact form factor for easy integration into various systems.

Boundary Scan: YES

Facilitates debugging and testing of the microcontroller during development.

Peripherals: "COMPARATOR(8), RTC, TIMER(4)

Offers a range of essential peripherals for diverse functionality.

Maximum Clock Frequency: 32 MHz

High clock speed enables fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliability during soldering and assembly processes.

Peak Reflow Temperature °C: 260

Capable of withstanding high temperatures during assembly.

Length: 5 mm

Compact design for space-saving installations.

Temperature Grade: INDUSTRIAL

Can operate reliably in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Optimized for efficient and high-performance computing tasks.

No. of Timers: 4

Provides timing and event control functions for various applications.

RAM Bytes: 6144

Generous memory capacity for temporary data storage and processing.

Technology: CMOS

Efficient and low-power technology for energy-efficient operation.

Terminal Form: BALL

Provides reliable electrical connections for robust performance.

Analog To Digital Convertors: 10-Ch 12-Bit

Supports multiple channels for analog input, essential for sensor applications.

Maximum Supply Current: 11 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 3 V

Stable voltage supply for consistent performance.

No. of DMA Channels: 3

Efficient data transfer and processing capabilities for improved performance.

No. of Serial I/Os: 4

Multiple serial communication options for interfacing with external devices.

PWM Channels: YES

Enables precise control of analog signals for various applications.

Connectivity: "I2C(2), SPI(4), UART(2), USB

Versatile communication interfaces for connecting to a wide range of devices.

ROM Programmability: FLASH

Allows for flexible and easy reprogramming of code and data.

Terminal Pitch: 0.5 mm

Fine pitch for high-density mounting on PCBs.

Format: FIXED POINT

Optimized for integer calculations, suitable for many applications.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture levels during operation and storage.

Speed: 25 rpm

Capable of fast processing speeds for real-time applications.

Low Power Mode: YES

Enables power-saving operation for extended battery life.

On Chip Program ROM Width: 8

Ample storage capacity for program code and data.

No. of I/O Lines: 47

Plenty of input/output options for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F5526IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), SPI(4), UART(2), USB"

Peripherals:

"COMPARATOR(8), RTC, TIMER(4)"

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430F5526IZQE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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