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MSP430F5524IYFFT

Texas Instruments

MSP430F5524IYFFT by Texas Instruments

MSP430F5524IYFFT by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at max 32 MHz. It features 12-Ch 12-Bit ADC channels and DMA support, suitable for industrial applications requiring low power consumption and high-speed processing. With various connectivity options like I2C, SPI, UART, and USB, it offers versatile interfacing capabilities in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,271 parts In-Stock

1+ parts

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8,271

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Digiode

USA . 3,987 parts In-Stock

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3,987

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 323 parts In-Stock

1+ parts

$6.000

100+ parts

-

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323

$6.000

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AZTECH Wire

Italy . 548 parts In-Stock

1+ parts

$9.893

100+ parts

-

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548

$9.893

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Parana Technologies

USA . 447 parts In-Stock

1+ parts

$31.845

100+ parts

-

1k+ parts

$90.527

10k+ parts

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447

$31.845

-

$90.527

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ChromeModa Solutions

Germany . 3,342 parts In-Stock

1+ parts

$35.781

100+ parts

$29.340

1k+ parts

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10k+ parts

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3,342

$35.781

$29.340

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IDEA Electronic Components Group

UK . 1,099 parts In-Stock

1+ parts

$35.781

100+ parts

$33.992

1k+ parts

$32.203

10k+ parts

-

1,099

$35.781

$33.992

$32.203

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Corphita

USA . 1,589 parts In-Stock

1+ parts

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1,589

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DigiPath Technology Company

USA . 799 parts In-Stock

1+ parts

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100+ parts

$32.260

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799

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$32.260

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Microchip USA

USA . 371 parts In-Stock

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371

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Overview

Unleash the power of innovation with the MSP430F5524IYFFT by Texas Instruments, a top-of-the-line microcontroller that redefines excellence in the industry. With a reputation for superior quality and cutting-edge technology, Texas Instruments delivers unparalleled performance in a compact package. Ideal for a wide range of applications, this microcontroller offers unmatched value, efficiency, and reliability to customers looking to take their projects to the next level. Experience seamless connectivity, advanced features, and exceptional functionality with the MSP430F5524IYFFT - your gateway to limitless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy body material makes the microcontroller lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort in production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources for flexibility in design.

Package Shape: SQUARE

Square package shape simplifies placement and orientation during assembly, improving the overall manufacturing process.

Bit Size: 16

16-bit processing capabilities provide sufficient power and performance for complex computing tasks in embedded systems.

Power Supplies (V): 2/3.3

Multiple power supply options allow for compatibility with different voltage inputs, making the microcontroller versatile in various environments.

No. of Terminals: 64

With a high number of terminals, this microcontroller offers ample I/O capabilities for connecting to peripherals and sensors.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with thin profile and fine pitch enables a compact design and efficient use of space on the PCB.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for energy-efficient operation and extends the battery life of portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions, such as industrial settings.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it a popular choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range from -40°C to 85°C allows the microcontroller to function reliably in extreme cold or hot environments.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance for reliable connections over time.

ADC Channels: YES

Built-in ADC channels enable analog signal acquisition, making the microcontroller suitable for interfacing with sensors and capturing real-world data.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position enhances thermal management and allows for more efficient heat dissipation, ensuring optimal performance under load.

ROM Words: 65536

Large ROM capacity of 65536 words provides ample storage for program code, data, and firmware, accommodating complex applications.

Maximum Seated Height: 0.625 mm

Low maximum seated height allows for a compact design with minimal space requirements, suitable for slim and portable devices.

Width: 3.76 mm

Narrow width of 3.76 mm facilitates space-saving PCB layout and allows for densely populated designs with multiple components.

Peripherals: COMPARATOR, DMA(3), RTC, TIMER(4), WDT

A comprehensive set of peripherals including comparator, DMA, RTC, timer, and watchdog timer enhances the microcontroller's functionality and versatility.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency of 32 MHz enables fast data processing and execution of instructions, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for a 30-second peak reflow time, ensuring proper soldering and component assembly during the manufacturing process.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable solder connections and component integrity during the PCB assembly process.

Length: 3.76 mm

Compact length of 3.76 mm contributes to a small form factor design, ideal for space-constrained applications and portable devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding industrial environments with wide temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance and power efficiency, suitable for real-time processing and control applications.

RAM Bytes: 6144

Generous RAM capacity of 6144 bytes provides temporary storage for data and variables, enabling efficient multitasking and data processing.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, contributing to energy-efficient operation.

Terminal Form: BALL

Ball terminal form simplifies soldering and assembly, ensuring reliable electrical connections and mechanical stability.

Analog To Digital Convertors: 12-Ch 12-Bit

Twelve-channel, 12-bit ADCs provide high-resolution analog-to-digital conversion for accurate sensor readings and precise data acquisition.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent operation and compatibility with standard power sources in electronic devices.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2), USB

Multiple connectivity options including I2C, IRDA, SPI, UART, and USB offer versatile communication interfaces for connecting to external devices.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates and software upgrades, enhancing the microcontroller's versatility.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4 mm enables high-density mounting and compact PCB design, ideal for miniaturized electronic devices.

Speed: 25 rpm

Rotational speed of 25 rpm provides a reference point for motor control applications, ensuring precise and consistent rotational motion.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits allows for efficient memory usage and storage of program instructions, optimizing performance and functionality.

No. of I/O Lines: 47

Abundance of 47 I/O lines enables versatile interfacing with external devices, sensors, and peripherals, expanding the microcontroller's capabilities.

Technical Specifications

Microcontrollers MSP430F5524IYFFT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

3.76 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

47

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.76 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

COMPARATOR, DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430F5524IYFFT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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