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MSP430F5514IZQE

Texas Instruments

MSP430F5514IZQE by Texas Instruments

MSP430F5514IZQE by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 32 MHz. It features 4 timers, 4096 RAM bytes, and connectivity options like I2C, SPI, UART, and USB. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,196 parts In-Stock

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Digiode

USA . 1,568 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 360 parts In-Stock

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360

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One Stop Electronics

USA . 772 parts In-Stock

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$8.000

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772

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AZTECH Wire

Italy . 41 parts In-Stock

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$19.828

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Parana Technologies

USA . 1,536 parts In-Stock

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$47.671

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DigiPath Technology Company

USA . 1,907 parts In-Stock

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$52.492

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$48.292

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$52.492

$48.292

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ChromeModa Solutions

Germany . 1,777 parts In-Stock

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$53.563

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$43.922

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$43.922

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IDEA Electronic Components Group

UK . 1,726 parts In-Stock

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$53.563

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$50.885

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$48.207

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$48.207

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Corphita

USA . 3,837 parts In-Stock

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Perfect Parts

USA . 806 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 360 parts In-Stock

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Glotronic Ltd.

UK . 288 parts In-Stock

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Microchip USA

USA . 111 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5514IZQE microcontroller. Crafted with precision and expertise, this device is a game-changer in the world of technology. With a wide range of applications, from IoT devices to consumer electronics, this microcontroller offers unparalleled performance and reliability. Experience the seamless integration, low power consumption, and advanced features that set this product apart from the rest. Elevate your projects to new heights with the MSP430F5514IZQE and witness the difference that quality craftsmanship can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input, providing flexibility in power supply options.

Bit Size: 16

16-bit architecture allows for more complex operations and calculations compared to lower bit sizes.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture typically leads to faster and more efficient processing, making this microcontroller a good choice for performance-critical applications.

Maximum Clock Frequency: 32 MHz

Higher clock frequency allows for faster operation and response times in real-time applications.

Connectivity: I2C(2), SPI(4), UART(2), USB

Multiple communication interfaces provide versatility in connecting to other devices and peripherals.

ROM Programmability: FLASH

Flash programmable ROM allows for quick and easy updates to the program memory, enabling flexibility in software development.

Low Power Mode: YES

Low power mode capability helps in reducing power consumption and extending battery life in portable and battery-powered applications.

Technical Specifications

Microcontrollers MSP430F5514IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), SPI(4), UART(2), USB"

Peripherals:

"COMPARATOR(8), RTC, TIMER(4)"

Trade Compliance

MSP430F5514IZQE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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