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MSP430F5509IRGZT

Texas Instruments

MSP430F5509IRGZT by Texas Instruments

MSP430F5509IRGZT by Texas Instruments is a 16-bit microcontroller with 2048 RAM words and 24576 ROM words. It operates at a max clock frequency of 32 MHz, making it suitable for industrial applications requiring low power consumption and high-speed processing. With features like 8-Ch 10-Bit ADC channels, DMA support, and various connectivity options (I2C, SPI, UART, USB), this microcontroller offers versatile solutions in embedded systems design.

Median Price

$3.927

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,904 parts In-Stock

1+ parts

$3.927

100+ parts

$3.441

1k+ parts

$1.944

10k+ parts

-

3,904

$3.927

$3.441

$1.944

-

Rochester

USA . 226 parts In-Stock

1+ parts

-

100+ parts

$3.040

1k+ parts

$2.720

10k+ parts

$2.560

226

-

$3.040

$2.720

$2.560

DigiKey

USA . 226 parts In-Stock

1+ parts

-

100+ parts

$4.000

1k+ parts

-

10k+ parts

-

226

-

$4.000

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,980 parts In-Stock

1+ parts

$2.793

100+ parts

-

1k+ parts

-

10k+ parts

-

4,980

$2.793

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-

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Vyrian

USA . 6,538 parts In-Stock

1+ parts

-

100+ parts

-

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-

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6,538

-

-

-

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DigiKey Marketplace

USA . 226 parts In-Stock

1+ parts

-

100+ parts

$2.810

1k+ parts

-

10k+ parts

-

226

-

$2.810

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 84 parts In-Stock

1+ parts

$2.646

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$2.646

-

-

-

Parana Technologies

USA . 692 parts In-Stock

1+ parts

$51.523

100+ parts

$4,784.691

1k+ parts

$46.371

10k+ parts

-

692

$51.523

$4,784.691

$46.371

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DigiPath Technology Company

USA . 1,010 parts In-Stock

1+ parts

$56.733

100+ parts

-

1k+ parts

-

10k+ parts

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1,010

$56.733

-

-

-

IDEA Electronic Components Group

UK . 700 parts In-Stock

1+ parts

$57.891

100+ parts

$54.996

1k+ parts

$52.102

10k+ parts

-

700

$57.891

$54.996

$52.102

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ChromeModa Solutions

Germany . 457 parts In-Stock

1+ parts

$57.891

100+ parts

$47.471

1k+ parts

-

10k+ parts

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457

$57.891

$47.471

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-

Perfect Parts

USA . 224 parts In-Stock

1+ parts

-

100+ parts

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224

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Overview

Unlock limitless possibilities with the Texas Instruments MSP430F5509IRGZT microcontroller. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers unmatched value, efficiency, and innovation. Experience seamless connectivity, advanced features, and exceptional quality with the MSP430F5509IRGZT - your key to unlocking the future of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in reducing the overall weight of the product.

Maximum Supply Voltage: 3.6 V

Supports a higher supply voltage, which can be beneficial in applications requiring higher power consumption.

On Chip Data RAM Width: 16

Wider data RAM width allows for more efficient storage and processing of data.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments, making it suitable for a wide range of applications.

ADC Channels: YES

Built-in Analog to Digital Convertors enable the device to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels help in efficient data transfer without CPU intervention, improving overall performance.

ROM Words: 24576

Large amount of Read-Only Memory allows for storing a significant amount of program data.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures fast and efficient processing of instructions, enhancing the performance of the microcontroller.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADC channels with 10-bit resolution provide accurate conversion of analog signals to digital values.

Connectivity: I2C, SPI(2), UART, USB

Support for various communication protocols enables easy integration with different devices and systems.

Technical Specifications

Microcontrollers MSP430F5509IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

2048

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART, USB

Peripherals:

BROWN-OUT DETECT, COMPARATOR, DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5509IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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