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MSP430F5508IZQER

Texas Instruments

MSP430F5508IZQER by Texas Instruments

MSP430F5508IZQER by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 32 MHz. Ideal for industrial applications, it features 4096 bytes of RAM, Flash ROM programmability, and ADC/DMA channels for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,199 parts In-Stock

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Digiode

USA . 4,126 parts In-Stock

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4,126

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Distributors (Availability)

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AZTECH Wire

Italy . 495 parts In-Stock

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$8.476

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495

$8.476

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One Stop Electronics

USA . 974 parts In-Stock

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$34.000

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974

$34.000

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Parana Technologies

USA . 2,152 parts In-Stock

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$64.684

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DigiPath Technology Company

USA . 533 parts In-Stock

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$71.225

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$65.527

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533

$71.225

$65.527

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ChromeModa Solutions

Germany . 3,036 parts In-Stock

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$72.679

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$59.597

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3,036

$72.679

$59.597

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IDEA Electronic Components Group

UK . 1,172 parts In-Stock

1+ parts

$72.679

100+ parts

$69.045

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$65.411

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1,172

$72.679

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$65.411

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Corphita

USA . 1,466 parts In-Stock

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Futuretech Components

Singapore . 829 parts In-Stock

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Microchip USA

USA . 453 parts In-Stock

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Overview

Unlock the power of innovation with the MSP430F5508IZQER by Texas Instruments, a top-tier manufacturer known for quality and reliability. This microcontroller offers endless possibilities in various applications due to its advanced features and cutting-edge technology. With a focus on value and efficiency, this product provides customers with unmatched performance, seamless integration, and optimal functionality. Embrace the future of technology with the MSP430F5508IZQER and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and ability to protect the internal components.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, making the product suitable for compact and space-constrained designs.

Maximum Supply Voltage: 3.6 V

With a relatively high maximum supply voltage, this microcontroller can handle a wide range of power inputs.

Package Shape: SQUARE

The square shape of the package offers efficient use of space and easy placement on a circuit board.

Bit Size: 16

A 16-bit architecture allows for efficient processing and handling of data, making the microcontroller suitable for a variety of applications.

Power Supplies (V): 2/3.3

Having multiple voltage options gives flexibility in powering the microcontroller, making it adaptable to different system requirements.

No. of Terminals: 80

A high number of terminals provide ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style allows for a compact design and efficient routing of signals, leading to improved performance and reliability.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even with lower power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, making it suitable for industrial applications.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making this microcontroller energy-efficient and reliable.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures that the microcontroller can function effectively in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals, making it versatile for a wide range of applications.

DMA Channels: YES

DMA channels enable efficient data transfer between peripherals and memory, improving overall system performance and responsiveness.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB layout and assembly, simplifying the manufacturing process.

ROM Words: 16384

With a large ROM capacity, this microcontroller can store a significant amount of program data and instructions, making it suitable for complex applications.

Maximum Seated Height: 1 mm

The low seated height allows for a slim and compact design, ideal for space-constrained applications.

Width: 5 mm

The small width dimension contributes to the overall compactness of the microcontroller, making it suitable for miniaturized designs.

Maximum Clock Frequency: 32 MHz

A high clock frequency enables fast processing speeds and quick response times, making the microcontroller suitable for high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures that the microcontroller can withstand the soldering process without compromising its performance or reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature indicates the robustness of the microcontroller during the soldering process, ensuring proper bonding to the PCB.

Length: 5 mm

The small length dimension contributes to the overall compactness of the microcontroller, making it suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges, this microcontroller is suitable for rugged applications that require high reliability and durability.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the peripheral IC allows for efficient execution of instructions, leading to improved performance and lower power consumption.

RAM Bytes: 4096

With a generous amount of RAM, this microcontroller can efficiently handle data storage and manipulation, making it suitable for multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating conditions.

Terminal Form: BALL

The ball terminal form provides good electrical connections and mechanical stability, ensuring reliable performance in demanding applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is ideal for compatibility with a wide range of power sources, making the microcontroller versatile for different applications.

PWM Channels: YES

PWM channels enable precise control of analog outputs, making the microcontroller suitable for applications requiring accurate voltage or frequency modulation.

ROM Programmability: FLASH

Flash ROM allows for easy programming and updating of firmware, making the microcontroller flexible and adaptable to evolving requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and compact PCB layout, optimizing space usage and facilitating miniaturized designs.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling, ensuring reliability in various environmental conditions.

Speed: 25 rpm

The specified speed may refer to clock frequency or processing speed, indicating the microcontroller's capability to handle tasks efficiently at a rate of 25 revolutions per minute.

No. of I/O Lines: 47

A high number of I/O lines provide ample interface options for connecting external devices or peripherals, enhancing the flexibility and functionality of the microcontroller.

Technical Specifications

Microcontrollers MSP430F5508IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

47

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

MSP430F5508IZQER Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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