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MSP430F5508IZQE

Texas Instruments

MSP430F5508IZQE by Texas Instruments

MSP430F5508IZQE by Texas Instruments is a 16-bit microcontroller with 2048 RAM words and 16384 ROM words. It operates at up to 32 MHz, features 12-Ch 10-Bit ADC channels, and offers low power mode. Ideal for industrial applications requiring high-speed processing and multiple peripherals like UART, USB, and I2C.

Median Price

$2.214

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$2.090

1k+ parts

$1.870

10k+ parts

$1.760

350

-

$2.090

$1.870

$1.760

Verical

USA . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.337

10k+ parts

$2.200

350

-

-

$2.337

$2.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$2.070

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$2.070

-

-

-

Digiode

USA . 2,309 parts In-Stock

1+ parts

$2.204

100+ parts

-

1k+ parts

-

10k+ parts

-

2,309

$2.204

-

-

-

Vyrian

USA . 6,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,348

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,231 parts In-Stock

1+ parts

$2.088

100+ parts

-

1k+ parts

-

10k+ parts

-

3,231

$2.088

-

-

-

AZTECH Wire

Italy . 849 parts In-Stock

1+ parts

$13.040

100+ parts

-

1k+ parts

-

10k+ parts

-

849

$13.040

-

-

-

Parana Technologies

USA . 613 parts In-Stock

1+ parts

$14.309

100+ parts

-

1k+ parts

$14.760

10k+ parts

-

613

$14.309

-

$14.760

-

ChromeModa Solutions

Germany . 2,720 parts In-Stock

1+ parts

$16.078

100+ parts

$13.184

1k+ parts

-

10k+ parts

-

2,720

$16.078

$13.184

-

-

IDEA Electronic Components Group

UK . 2,122 parts In-Stock

1+ parts

$16.078

100+ parts

$15.274

1k+ parts

$14.470

10k+ parts

-

2,122

$16.078

$15.274

$14.470

-

Component Stockers USA

USA . 322 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

322

$99.990

-

-

-

DigiPath Technology Company

USA . 466 parts In-Stock

1+ parts

-

100+ parts

$14.496

1k+ parts

-

10k+ parts

-

466

-

$14.496

-

-

Microchip USA

USA . 420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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420

-

-

-

-

Overview

Experience unmatched quality and reliability with the MSP430F5508IZQE microcontroller by Texas Instruments. This versatile device offers a wide range of applications in various industries, thanks to its advanced features and cutting-edge technology. With its low power consumption and high performance, this microcontroller provides exceptional value and benefits to customers looking for efficient solutions. Trust in Texas Instruments' reputation for excellence and innovation, and unlock the possibilities with the MSP430F5508IZQE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the microcontroller and ensures durability.

Maximum Supply Voltage: 3.6 V

Allows for a wide voltage range which can be useful in various applications.

CPU Family: MSP430

MSP430 family is known for its low power consumption and high performance, making it a reliable choice for energy-efficient applications.

Maximum Clock Frequency: 32 MHz

Enables faster processing speed and efficient performance.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the microcontroller's code.

Connectivity: I2C, SPI(2), UART, USB

Offers multiple connectivity options, making it versatile and suitable for a wide range of communication protocols.

Technical Specifications

Microcontrollers MSP430F5508IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART, USB

Peripherals:

BROWN-OUT DETECT, COMPARATOR, DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5508IZQE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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