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MSP430F5508IRGCT

Texas Instruments

MSP430F5508IRGCT by Texas Instruments

MSP430F5508IRGCT by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 2048 RAM words, and 12-Ch 10-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features I2C, SPI(2), UART connectivity options and on-chip flash ROM programmability.

Median Price

$3.963

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,500 parts In-Stock

1+ parts

$1.730

100+ parts

$1.700

1k+ parts

$1.660

10k+ parts

-

7,500

$1.730

$1.700

$1.660

-

Texas Instruments

USA . 12,750 parts In-Stock

1+ parts

$3.963

100+ parts

$3.473

1k+ parts

$1.962

10k+ parts

-

12,750

$3.963

$3.473

$1.962

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DigiKey

USA . 282 parts In-Stock

1+ parts

$4.960

100+ parts

$3.159

1k+ parts

$2.864

10k+ parts

$2.753

282

$4.960

$3.159

$2.864

$2.753

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$2.935

100+ parts

-

1k+ parts

-

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64

$2.935

-

-

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Digiode

USA . 1,812 parts In-Stock

1+ parts

$3.765

100+ parts

-

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1,812

$3.765

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Vyrian

USA . 3,902 parts In-Stock

1+ parts

-

100+ parts

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3,902

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$2.876

100+ parts

-

1k+ parts

$2.761

10k+ parts

-

1,000

$2.876

-

$2.761

-

Continental Prestige Electronics

USA . 6,777 parts In-Stock

1+ parts

$2.935

100+ parts

-

1k+ parts

-

10k+ parts

$2.876

6,777

$2.935

-

-

$2.876

Argo Parts USA

USA . 3,082 parts In-Stock

1+ parts

$2.935

100+ parts

-

1k+ parts

-

10k+ parts

-

3,082

$2.935

-

-

-

Advanced Electronics

New Zealand . 46 parts In-Stock

1+ parts

$2.994

100+ parts

$2.994

1k+ parts

$2.994

10k+ parts

-

46

$2.994

$2.994

$2.994

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Ampacity Inc.

Singapore . 6,227 parts In-Stock

1+ parts

$3.370

100+ parts

-

1k+ parts

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6,227

$3.370

-

-

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Corphita

USA . 4,027 parts In-Stock

1+ parts

$3.567

100+ parts

-

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10k+ parts

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4,027

$3.567

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Parana Technologies

USA . 2,133 parts In-Stock

1+ parts

$41.312

100+ parts

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2,133

$41.312

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DigiPath Technology Company

USA . 710 parts In-Stock

1+ parts

$45.490

100+ parts

$41.850

1k+ parts

-

10k+ parts

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710

$45.490

$41.850

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ChromeModa Solutions

Germany . 3,843 parts In-Stock

1+ parts

$46.418

100+ parts

$38.063

1k+ parts

-

10k+ parts

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3,843

$46.418

$38.063

-

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IDEA Electronic Components Group

UK . 1,551 parts In-Stock

1+ parts

$46.418

100+ parts

$44.097

1k+ parts

$41.776

10k+ parts

-

1,551

$46.418

$44.097

$41.776

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Corohmni

South Africa . 1,164 parts In-Stock

1+ parts

$86.318

100+ parts

-

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1,164

$86.318

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F5508IRGCT microcontroller. This cutting-edge chip offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. With its advanced features and top-notch quality, Texas Instruments continues to set the standard in the industry. Whether you're designing smart devices, industrial automation systems, or IoT solutions, this microcontroller delivers unmatched value, efficiency, and flexibility. Stay ahead of the curve and unleash your creativity with the MSP430F5508IRGCT microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easy to mount on PCB for efficient assembly.

Maximum Supply Voltage: 3.6 V

Supports higher voltage operations for versatile use cases.

On Chip Data RAM Width: 16

Enhanced data processing capabilities with wider RAM width.

Package Shape: SQUARE

Compact design for space-saving installations.

Bit Size: 16

Suitable for handling moderate complexities in operations.

Power Supplies (V): 2/3.3

Offers flexibility with multiple power supply options.

No. of Terminals: 64

Sufficient terminals for connection to external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles for different environmental requirements.

Minimum Supply Voltage: 2.4 V

Low power operation possible with lower supply voltage.

Maximum Operating Temperature: 85 °C

Operates reliably in higher temperature environments.

CPU Family: MSP430

Part of a reputable CPU family known for performance and reliability.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable finish for long-term use and reliable connections.

ADC Channels: YES

Integrated ADC for analog input processing.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer.

Terminal Position: QUAD

Quad-terminal layout for easy circuit connectivity.

ROM Words: 16384

Large ROM capacity for program storage.

Maximum Seated Height: 1 mm

Low-profile design for compact device integration.

RAM Words: 2048

Adequate RAM capacity for data processing and storage.

Width: 9 mm

Narrow width for fitting into tight spaces.

Boundary Scan: YES

Boundary scan capability for testing and debugging.

Peripherals: BROWN-OUT DETECT, COMPARATOR, DMA(3), RTC, TIMER(4), WDT

Rich set of peripherals for versatile functionality.

Maximum Clock Frequency: 32 MHz

High clock frequency for fast processing speeds.

Maximum Time At Peak Reflow Temperature (s): 30

Supports reflow soldering for efficient manufacturing.

Peak Reflow Temperature °C: 260

Handles high reflow temperatures during assembly.

Length: 9 mm

Compact length for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for rugged environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller for efficient processing.

No. of Timers: 4

Multiple timers for time-sensitive operations.

RAM Bytes: 4096

Sufficient RAM memory for data handling.

Technology: CMOS

CMOS technology for low power consumption and high reliability.

Terminal Form: NO LEAD

Lead-free terminal form for environmental compliance.

Analog To Digital Convertors: 12-Ch 10-Bit

Multiple ADC channels for analog signal processing.

Maximum Supply Current: 6.5 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 3 V

Stable nominal voltage for consistent performance.

No. of DMA Channels: 3

Multiple DMA channels for efficient data transfers.

No. of Serial I/Os: 2

Support for serial communication interfaces.

PWM Channels: YES

PWM channels for precise control of output signals.

Connectivity: I2C, SPI(2), UART, USB

Versatile connectivity options for different devices.

ROM Programmability: FLASH

Flash ROM for easy reprogrammability of code.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts.

Format: FIXED POINT

Fixed-point format for efficient numerical calculations.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for typical handling.

Speed: 25 rpm

Operates at a moderate speed suitable for various applications.

Low Power Mode: YES

Low power mode for energy-saving operation.

On Chip Program ROM Width: 8

Program ROM with sufficient width for storing code.

No. of I/O Lines: 47

Plenty of I/O lines for interfacing with external devices.

Technical Specifications

Microcontrollers MSP430F5508IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART, USB

Peripherals:

BROWN-OUT DETECT, COMPARATOR, DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5508IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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