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MSP430F5506IRGZR

Texas Instruments

MSP430F5506IRGZR by Texas Instruments

MSP430F5506IRGZR by Texas Instruments is a 16-bit microcontroller with 48 terminals, operating at up to 32 MHz. It features 8 ADC channels, 18 timers, and low power mode ideal for industrial applications requiring high-speed processing and connectivity via I2C, LIN, SPI, UART.

Median Price

$2.945

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,910 parts In-Stock

1+ parts

$2.945

100+ parts

$2.581

1k+ parts

$1.458

10k+ parts

-

14,910

$2.945

$2.581

$1.458

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,479 parts In-Stock

1+ parts

$2.798

100+ parts

-

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-

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2,479

$2.798

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-

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Vyrian

USA . 6,198 parts In-Stock

1+ parts

-

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6,198

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,160 parts In-Stock

1+ parts

$2.650

100+ parts

-

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-

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3,160

$2.650

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Parana Technologies

USA . 273 parts In-Stock

1+ parts

$14.332

100+ parts

-

1k+ parts

$14.782

10k+ parts

-

273

$14.332

-

$14.782

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DigiPath Technology Company

USA . 1,613 parts In-Stock

1+ parts

$15.781

100+ parts

$14.518

1k+ parts

-

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1,613

$15.781

$14.518

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ChromeModa Solutions

Germany . 5,367 parts In-Stock

1+ parts

$16.103

100+ parts

$13.204

1k+ parts

-

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5,367

$16.103

$13.204

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IDEA Electronic Components Group

UK . 309 parts In-Stock

1+ parts

$16.103

100+ parts

$15.298

1k+ parts

$14.493

10k+ parts

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309

$16.103

$15.298

$14.493

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AZTECH Wire

Italy . 150 parts In-Stock

1+ parts

$18.820

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150

$18.820

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Kepictronics

USA . 74 parts In-Stock

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74

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5506IRGZR microcontroller. Designed for cutting-edge applications, this product offers unparalleled quality and reliability. With a wide range of peripherals including comparators, timers, and UART connectivity, this microcontroller is perfect for industrial use. Experience low power consumption and high-speed performance with the MSP430 family, providing customers with exceptional value and endless possibilities. Upgrade your projects today with the Texas Instruments MSP430F5506IRGZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the microcontroller, ensuring longevity and reliability in various environmental conditions.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of input power levels, providing flexibility in different applications.

No. of Terminals: 48

Having a high number of terminals allows for more connections and peripherals to be integrated, increasing the versatility and functionality of the microcontroller.

Maximum Clock Frequency: 32 MHz

The high clock frequency enables fast processing speeds, making this microcontroller suitable for applications that require quick data processing and response times.

Analog To Digital Convertors: 8-Ch 10-Bit

The multiple ADC channels with high resolution allow for accurate analog signal conversion, making this microcontroller ideal for applications that involve sensor inputs or data acquisition.

Connectivity: "I2C, IRDA, LIN, SPI, UART, USCI(2)

The various connectivity options provide flexibility in communication protocols, allowing seamless integration with other devices and systems in a network.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption, making this microcontroller energy-efficient and suitable for battery-operated devices or applications where power efficiency is critical.

Technical Specifications

Microcontrollers MSP430F5506IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

31

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"COMPARATOR, CRC, DMA(3),RTC, TIMER(18), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5506IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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