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MSP430F5436AIZCAR

Texas Instruments

MSP430F5436AIZCAR by Texas Instruments

MSP430F5436AIZCAR by Texas Instruments is a 16-bit microcontroller with 113 terminals, 32 MHz clock frequency, and 16 ADC channels. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. Features include 3 DMA channels, 15 timers, and various connectivity options like I2C and UART.

Median Price

$5.917

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,830 parts In-Stock

1+ parts

$5.917

100+ parts

$4.824

1k+ parts

$3.216

10k+ parts

-

8,830

$5.917

$4.824

$3.216

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,762 parts In-Stock

1+ parts

$5.621

100+ parts

-

1k+ parts

-

10k+ parts

-

1,762

$5.621

-

-

-

Vyrian

USA . 6,954 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,954

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,927 parts In-Stock

1+ parts

$5.325

100+ parts

-

1k+ parts

-

10k+ parts

-

1,927

$5.325

-

-

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AZTECH Wire

Italy . 968 parts In-Stock

1+ parts

$9.040

100+ parts

-

1k+ parts

-

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968

$9.040

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-

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Microchip USA

USA . 1,332 parts In-Stock

1+ parts

$27.450

100+ parts

$27.280

1k+ parts

$27.190

10k+ parts

$27.110

1,332

$27.450

$27.280

$27.190

$27.110

Parana Technologies

USA . 644 parts In-Stock

1+ parts

$68.078

100+ parts

-

1k+ parts

-

10k+ parts

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644

$68.078

-

-

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DigiPath Technology Company

USA . 312 parts In-Stock

1+ parts

$74.962

100+ parts

$68.965

1k+ parts

-

10k+ parts

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312

$74.962

$68.965

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ChromeModa Solutions

Germany . 3,076 parts In-Stock

1+ parts

$76.492

100+ parts

$62.723

1k+ parts

-

10k+ parts

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3,076

$76.492

$62.723

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IDEA Electronic Components Group

UK . 1,157 parts In-Stock

1+ parts

$76.492

100+ parts

$72.667

1k+ parts

$68.843

10k+ parts

-

1,157

$76.492

$72.667

$68.843

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QUARKTWIN TECHNOLOGY LTD

USA . 8,800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,800

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F5436AIZCAR microcontroller. Crafted with precision and expertise, this device boasts unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller offers seamless connectivity and exceptional performance. Experience the value of superior design and innovation with this product, providing customers with countless benefits and advantages. Upgrade your projects with the MSP430F5436AIZCAR and elevate your work to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for better handling and protection of the microcontroller.

Surface Mount: YES

Enables easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for operation in a wide range of voltage conditions.

No. of I/O Lines: 87

Provides ample input/output options for connecting to various external devices and circuits.

ADC Channels: YES

Integrated Analog to Digital Convertors provide capability for analog signal processing.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of output signals.

Connectivity: I2C, IRDA, SCI(3), SPI, UART

Multiple communication interfaces allow for versatile connectivity options.

Maximum Clock Frequency: 32 MHz

High clock speed enables fast processing and response times.

ROM Programmability: FLASH

Flash programmable ROM offers flexibility for updating and modifying code.

Low Power Mode: YES

Efficient power management feature for reducing power consumption during idle or low activity periods.

Technical Specifications

Microcontrollers MSP430F5436AIZCAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES MINIMUM 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

87

No. of Serial I/Os:

3

No. of Terminals:

113

No. of Timers:

15

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

8192

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

9.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SCI(3), SPI, UART

Peripherals:

BOD, CRC, DMA(3), RTC, TIMER(15), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F5436AIZCAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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