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MSP430F5359IZQWT

Texas Instruments

MSP430F5359IZQWT by Texas Instruments

MSP430F5359IZQWT by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 524288 ROM words, and 66 RAM words. Ideal for industrial applications, it features 8 external interrupts, 12-bit DAC channels, and connectivity options like I2C, SPI, and UART. With low power mode and high clock frequency of 32MHz, it offers efficient performance in compact form factor.

Median Price

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Lifecycle Status

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5

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1k+

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Chip Stock

USA . 9,655 parts In-Stock

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Vyrian

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Digiode

USA . 1,325 parts In-Stock

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Sensible Micro Corp

USA . 57 parts In-Stock

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Cyclops Electronics Ltd

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One Stop Electronics

USA . 246 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 553 parts In-Stock

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Parana Technologies

USA . 1,482 parts In-Stock

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DigiPath Technology Company

USA . 347 parts In-Stock

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ChromeModa Solutions

Germany . 5,679 parts In-Stock

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IDEA Electronic Components Group

UK . 1,066 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Microchip USA

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5359IZQWT microcontroller. Crafted with precision and excellence, this versatile device offers a wide range of applications in various industries. From IoT to consumer electronics, the possibilities are endless. With a focus on quality and reliability, Texas Instruments ensures that every product delivers exceptional performance. Experience the value and benefits of cutting-edge technology with the MSP430F5359IZQWT, designed to empower your projects and drive success. Elevate your creations with this game-changing microcontroller and unlock a world of opportunities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 3.6 V

Supporting a maximum supply voltage of 3.6V ensures compatibility with various power sources, making it versatile for different designs.

Package Shape: SQUARE

The square package shape helps in optimizing space on the PCB layout, allowing for efficient arrangement of components.

Bit Size: 16

With a 16-bit size, this microcontroller offers enhanced processing power and performance for handling complex tasks and calculations.

DAC Channels: YES

Having DAC channels allows for accurate analog output signals, essential for applications such as audio processing and sensor interfacing.

Power Supplies (V): 2/3.3

Supporting multiple power supply options (2V and 3.3V) provides flexibility in design and ensures compatibility with various power sources.

No. of Terminals: 113

Having 113 terminals allows for versatile connectivity options and the ability to interface with a wide range of external components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch design enhances PCB layout efficiency and allows for compact and space-saving designs.

Minimum Supply Voltage: 2.4 V

Supporting a minimum supply voltage of 2.4V ensures operational reliability even under low power conditions, making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand harsh environmental conditions and temperature fluctuations.

CPU Family: MSP430

Being part of the MSP430 CPU family ensures compatibility with existing software and development tools, simplifying the design and programming process.

No. of External Interrupts: 8

The 8 external interrupts enable the microcontroller to respond quickly to external events and signals, enhancing real-time processing capabilities.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this microcontroller is suitable for use in cold environments or applications that require operation in sub-zero temperatures.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides reliable conductivity and corrosion resistance, ensuring long-term performance and durability.

ADC Channels: YES

Having ADC channels enables the microcontroller to accurately measure and convert analog signals to digital data, essential for sensor-based applications and data acquisition.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer and processing, reducing the CPU workload and improving overall system performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting on PCBs, ensuring stable connections and reliable operation in various applications.

ROM Words: 524288

With a large ROM size of 524288 words, this microcontroller offers ample storage capacity for program code, data, and firmware, accommodating complex software requirements.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for compact and slim device designs, ideal for applications where space constraints are a concern.

Digital To Analog Convertors: 2-Ch 12-Bit

Featuring two 12-bit DACs enables the microcontroller to generate precise analog output signals with high resolution, supporting applications that require accurate voltage control.

RAM Words: 66

Although the RAM size is limited to 66 words, it is sufficient for storing temporary data and variables during program execution, ensuring smooth multitasking and data processing.

Width: 7 mm

The compact width of 7mm allows for space-efficient PCB layout and component placement, contributing to a streamlined and optimized design.

Boundary Scan: YES

Having boundary scan capability facilitates efficient testing and debugging of the microcontroller during manufacturing and development, ensuring product quality and reliability.

Peripherals: BOR, COMPARATOR(12), DMA(6), POR, PWM, RTC, TIMER(4), WDT

The diverse range of peripherals including Brownout Reset (BOR), comparators, DMA, PWM, RTC, timers, and watchdog timer (WDT) enhance the functionality and versatility of the microcontroller for various applications.

Maximum Clock Frequency: 32 MHz

With a high maximum clock frequency of 32MHz, this microcontroller can execute instructions and process data at a fast rate, suitable for high-speed applications and real-time processing.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 260°C for 30 seconds ensures proper soldering and bonding during manufacturing, avoiding thermal damage to the device.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can withstand soldering processes without damage, ensuring reliable assembly in manufacturing.

Length: 7 mm

The compact length of 7mm contributes to a space-saving design and allows for flexibility in incorporating the microcontroller into various compact devices and systems.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this microcontroller can operate reliably in rugged environments and withstand harsh conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high-speed processing, reduced power consumption, and efficient code execution, making it ideal for performance-critical applications.

No. of Timers: 4

Having 4 timers provides timing and scheduling functions essential for tasks such as PWM generation, event triggering, and time-based operations, enhancing system control and functionality.

RAM Bytes: 67584

The microcontroller's RAM capacity of 67584 bytes allows for efficient data storage and manipulation during program execution, supporting multitasking and data-intensive applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high speed, and noise immunity, making the microcontroller energy-efficient and reliable for various battery-powered devices.

Terminal Form: BALL

The ball terminal form factor provides reliable electrical connections and solder joints, ensuring stable performance and secure mounting on the PCB.

Analog To Digital Convertors: 16-Ch 12-Bit

Featuring sixteen 12-bit ADC channels allows the microcontroller to accurately digitize multiple analog signals simultaneously, enabling precise data acquisition and sensor interfacing.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and efficient operation of the microcontroller, suitable for a wide range of applications and power sources.

No. of DMA Channels: 6

Having 6 DMA channels enhances data transfer efficiency and offloads processing tasks from the CPU, improving overall system performance and responsiveness.

No. of Serial I/Os: 2

With 2 serial I/O ports, the microcontroller can communicate with external devices and peripherals using serial communication protocols, enabling seamless data exchange and control.

PWM Channels: YES

Supporting PWM channels allows for precise control of analog outputs, essential for applications such as motor control, LED dimming, and power management.

Technical Specifications

Microcontrollers MSP430F5359IZQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

74

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

4

On Chip Data RAM Width:

0

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

67584

RAM Words:

66

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

BOR, COMPARATOR(12), DMA(6), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F5359IZQWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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