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MSP430F5358IPZR

Texas Instruments

MSP430F5358IPZR by Texas Instruments

MSP430F5358IPZR by Texas Instruments is a 16-bit microcontroller with 393216 ROM words and 34 RAM words. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like 2-Ch 12-Bit DACs, 16-Ch ADCs, and multiple connectivity options (I2C, SPI, UART), it offers versatile solutions in embedded systems design.

Median Price

$9.434

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,522 parts In-Stock

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$7.138

100+ parts

$6.235

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$4.300

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9,522

$7.138

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$4.300

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Mouser Electronics

USA . 1,000 parts In-Stock

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$11.730

100+ parts

$9.970

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$7.430

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1,000

$11.730

$9.970

$7.430

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Distributors (In-Stock)

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Digiode

USA . 3,957 parts In-Stock

1+ parts

$6.781

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3,957

$6.781

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Nova Conductors

Japan . 10 parts In-Stock

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$6.923

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10

$6.923

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Bristol Electronics

USA . 4 parts In-Stock

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$11.250

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4

$11.250

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Vyrian

USA . 8,757 parts In-Stock

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Microfarads

USA . 4 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 5,008 parts In-Stock

1+ parts

$6.070

100+ parts

$5.918

1k+ parts

$5.888

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5,008

$6.070

$5.918

$5.888

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Ampacity Inc.

Singapore . 4,873 parts In-Stock

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$6.070

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$6.070

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Corphita

USA . 2,137 parts In-Stock

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$6.424

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Continental Prestige Electronics

USA . 978 parts In-Stock

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$6.923

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$6.785

978

$6.923

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$6.785

Corohmni

South Africa . 87 parts In-Stock

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$23.601

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87

$23.601

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Parana Technologies

USA . 1,894 parts In-Stock

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$32.088

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$96.552

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$32.088

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DigiPath Technology Company

USA . 579 parts In-Stock

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$35.333

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$32.506

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579

$35.333

$32.506

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IDEA Electronic Components Group

UK . 1,620 parts In-Stock

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$36.054

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$34.251

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$32.449

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$36.054

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$32.449

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ChromeModa Solutions

Germany . 1,614 parts In-Stock

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$36.054

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$29.564

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Lixinc

USA . 10,402 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Argo Parts USA

USA . 2,204 parts In-Stock

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Futuretech Components

Singapore . 144 parts In-Stock

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Overview

Enhance your products with the cutting-edge technology of the MSP430F5358IPZR microcontroller by Texas Instruments. Designed with precision and quality in mind, this device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to IoT devices, the MSP430F5358IPZR delivers powerful features like DAC channels, DMA capabilities, and low power modes to optimize efficiency and functionality. Trust Texas Instruments to provide top-of-the-line solutions that bring value and innovation to your projects. Elevate your designs with the MSP430F5358IPZR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the microcontroller from external elements, making it a reliable choice.

Surface Mount: YES

This allows for easy and secure installation on circuit boards, streamlining the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a high supply voltage, this microcontroller can handle a wide range of power inputs, increasing versatility in usage.

Package Shape: SQUARE

The square shape saves space on the circuit board, making it ideal for compact designs.

Bit Size: 16

This microcontroller's 16-bit architecture allows for higher precision and efficiency in data processing.

DAC Channels: YES

The inclusion of DAC channels enables the microcontroller to output analog signals, expanding its functionality.

Power Supplies (V): 2/3.3

This microcontroller can operate using different voltage supplies, offering flexibility for various applications.

No. of Terminals: 100

With a large number of terminals, this microcontroller can connect to multiple components, enhancing its connectivity.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This packaging style ensures a compact design, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage allows the microcontroller to operate efficiently even with low power input.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this microcontroller can withstand harsh environmental conditions.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making this microcontroller energy-efficient.

No. of External Interrupts: 8

The multiple external interrupt inputs enable the microcontroller to respond quickly to external events.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliability in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, increasing the longevity of the microcontroller.

ADC Channels: YES

With ADC channels, this microcontroller can accurately convert analog signals to digital data, enhancing its sensing capabilities.

DMA Channels: YES

The inclusion of DMA channels allows for direct memory access, improving data transfer speeds and efficiency.

Terminal Position: QUAD

The quad terminal position simplifies the installation process and enhances stability on the circuit board.

ROM Words: 393216

The large ROM capacity allows for storing a significant amount of program data, making this microcontroller suitable for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height enables the microcontroller to fit in slim designs, expanding its usage possibilities.

Technical Specifications

Microcontrollers MSP430F5358IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

74

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

0

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

34816

RAM Words:

34

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

BOR, COMPARATOR(12), DMA(6), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F5358IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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