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MSP430F5328IZQER

Texas Instruments

MSP430F5328IZQER by Texas Instruments

MSP430F5328IZQER by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 10 RAM words. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring low power consumption. Features include 12 ADC channels, 3 DMA channels, and various connectivity options like I2C, SPI, and UART.

Median Price

$4.230

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

USA . 8,086 parts In-Stock

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Chip Stock

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Digiode

USA . 2,394 parts In-Stock

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Microfarads

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Connector Distribution Corp

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Right Parts Inc.

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ComSIT Distribution GmbH

Germany . 83 parts In-Stock

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Prism Electronics

USA . 25 parts In-Stock

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EPE Components Inc.

USA . 10 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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Semicontronic

India . 856 parts In-Stock

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$2.000

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$1.950

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$1.940

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856

$2.000

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Continental Prestige Electronics

USA . 2,516 parts In-Stock

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$4.230

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Argo Parts USA

USA . 474 parts In-Stock

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Ampacity Inc.

Singapore . 1,625 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 867 parts In-Stock

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$13.911

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One Stop Electronics

USA . 1,218 parts In-Stock

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$16.000

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Parana Technologies

USA . 1,022 parts In-Stock

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$30.735

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$69.329

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$31.455

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$29.882

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DigiPath Technology Company

USA . 1,517 parts In-Stock

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$33.843

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ChromeModa Solutions

Germany . 3,719 parts In-Stock

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$34.534

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$28.318

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IDEA Electronic Components Group

UK . 17 parts In-Stock

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$34.534

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$32.807

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Corohmni

South Africa . 118 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Corphita

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Authorized Procurement Solutions

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Assy Fe

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Microchip USA

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F5328IZQER microcontroller. Designed with precision and expertise, this device offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, the MSP430F5328IZQER delivers unmatched reliability and efficiency. With advanced features like DMA channels and multiple timers, this microcontroller is perfect for any project requiring top-notch performance. Trust in Texas Instruments to provide you with the tools you need to take your designs to the next level. Experience the difference with the MSP430F5328IZQER today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package material helps in reducing the overall weight of the microcontroller, making it suitable for portable or lightweight applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of power sources.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage, improving overall performance of the microcontroller.

Package Shape: SQUARE

Square package shape makes it easier to mount and integrate the microcontroller onto circuit boards, optimizing space usage.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency enables fast data processing and execution of instructions, making the microcontroller suitable for applications requiring high-speed performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient instruction execution and high performance, making it a reliable choice for various embedded applications.

Low Power Mode: YES

The availability of low power mode helps in reducing power consumption, extending battery life and making the microcontroller suitable for energy-efficient applications.

Technical Specifications

Microcontrollers MSP430F5328IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MIN SUPPLY AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

63

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

RAM Words:

10

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(3), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430F5328IZQER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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