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MSP430F5328IZQE

Texas Instruments

MSP430F5328IZQE by Texas Instruments

MSP430F5328IZQE by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 10 RAM words. It operates at a max frequency of 32 MHz, suitable for industrial applications requiring low power consumption. Features include 12 ADC channels, 3 DMA channels, and various connectivity options like I2C and UART.

Median Price

$4.760

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$4.760

1k+ parts

$4.260

10k+ parts

$4.010

15

-

$4.760

$4.260

$4.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.710

100+ parts

-

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-

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50

$4.710

-

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Digiode

USA . 4,763 parts In-Stock

1+ parts

$5.026

100+ parts

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4,763

$5.026

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Vyrian

USA . 8,752 parts In-Stock

1+ parts

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8,752

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Chip Stock

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Connector Distribution Corp

USA . 91 parts In-Stock

1+ parts

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91

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Right Parts Inc.

USA . 91 parts In-Stock

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91

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 15 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

15

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 11 parts In-Stock

1+ parts

$4.500

100+ parts

-

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11

$4.500

-

-

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Bastille Electronics

Australia . 269 parts In-Stock

1+ parts

$4.710

100+ parts

$4.474

1k+ parts

$4.251

10k+ parts

$4.192

269

$4.710

$4.474

$4.251

$4.192

Continental Prestige Electronics

USA . 524 parts In-Stock

1+ parts

$4.710

100+ parts

-

1k+ parts

-

10k+ parts

$4.616

524

$4.710

-

-

$4.616

Corphita

USA . 2,104 parts In-Stock

1+ parts

$4.761

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2,104

$4.761

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AZTECH Wire

Italy . 741 parts In-Stock

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$18.339

100+ parts

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741

$18.339

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Advanced Electronics

New Zealand . 87 parts In-Stock

1+ parts

$26.777

100+ parts

$25.438

1k+ parts

$25.438

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87

$26.777

$25.438

$25.438

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Aztec Data Supply Inc.

USA . 3,533 parts In-Stock

1+ parts

$37.460

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3,533

$37.460

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Parana Technologies

USA . 10 parts In-Stock

1+ parts

$52.404

100+ parts

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10

$52.404

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DigiPath Technology Company

USA . 1,851 parts In-Stock

1+ parts

$57.703

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1,851

$57.703

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ChromeModa Solutions

Germany . 804 parts In-Stock

1+ parts

$58.881

100+ parts

$48.282

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804

$58.881

$48.282

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IDEA Electronic Components Group

UK . 4 parts In-Stock

1+ parts

$58.881

100+ parts

$55.937

1k+ parts

$52.993

10k+ parts

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4

$58.881

$55.937

$52.993

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Argo Parts USA

USA . 3,023 parts In-Stock

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3,023

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Microchip USA

USA . 280 parts In-Stock

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280

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Overview

Unlock the potential of your electronic designs with the MSP430F5328IZQE by Texas Instruments, a high-quality microcontroller offering unmatched performance and reliability. Ideal for a wide range of applications, this innovative product boasts advanced features such as low power mode, multiple connectivity options, and a wide range of peripherals. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this microcontroller will deliver value and benefits to meet your design needs. Elevate your projects to the next level with the MSP430F5328IZQE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, increasing versatility.

No. of Timers: 18

Allows for precise timing and scheduling of tasks.

ADC Channels: YES

Enables analog to digital conversion for sensor interfacing.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing.

ROM Programmability: FLASH

Flash programmable memory allows for easy updating of software.

Connectivity: "I2C, IRDA, SCI(2), SPI(2), UART

Provides multiple communication options for diverse applications.

Low Power Mode: YES

Enables power-saving features for energy-efficient operation.

Technical Specifications

Microcontrollers MSP430F5328IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MIN SUPPLY AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

63

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

RAM Words:

10

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(3), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430F5328IZQE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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