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MSP430F5310IRGZT

Texas Instruments

MSP430F5310IRGZT by Texas Instruments

MSP430F5310IRGZT by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 8-Ch 10-Bit ADC, and 18 timers. Ideal for industrial applications due to -40 to 85 °C operating temp range, low power mode, and various peripherals like BOD, CRC, PWM. Package style: CHIP CARRIER, HEAT SINK/SLUG.

Median Price

$4.506

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,473 parts In-Stock

1+ parts

$1.710

100+ parts

$1.680

1k+ parts

$1.640

10k+ parts

-

1,473

$1.710

$1.680

$1.640

-

Texas Instruments

USA . 10,750 parts In-Stock

1+ parts

$4.002

100+ parts

$3.506

1k+ parts

$1.981

10k+ parts

-

10,750

$4.002

$3.506

$1.981

-

Mouser Electronics

USA . 257 parts In-Stock

1+ parts

$5.010

100+ parts

$3.520

1k+ parts

$2.780

10k+ parts

-

257

$5.010

$3.520

$2.780

-

DigiKey

USA . 30 parts In-Stock

1+ parts

$5.010

100+ parts

$3.190

1k+ parts

$2.893

10k+ parts

$2.781

30

$5.010

$3.190

$2.893

$2.781

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,071 parts In-Stock

1+ parts

$1.624

100+ parts

-

1k+ parts

-

10k+ parts

-

3,071

$1.624

-

-

-

Chip Stock

USA . 21,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,720

-

-

-

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Vyrian

USA . 3,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,115

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,995 parts In-Stock

1+ parts

$1.450

100+ parts

-

1k+ parts

-

10k+ parts

-

2,995

$1.450

-

-

-

Corphita

USA . 1,872 parts In-Stock

1+ parts

$1.539

100+ parts

-

1k+ parts

-

10k+ parts

-

1,872

$1.539

-

-

-

Microchip USA

USA . 3,177 parts In-Stock

1+ parts

$25.013

100+ parts

-

1k+ parts

-

10k+ parts

-

3,177

$25.013

-

-

-

Parana Technologies

USA . 836 parts In-Stock

1+ parts

$51.153

100+ parts

-

1k+ parts

-

10k+ parts

-

836

$51.153

-

-

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DigiPath Technology Company

USA . 1,057 parts In-Stock

1+ parts

$56.326

100+ parts

-

1k+ parts

-

10k+ parts

-

1,057

$56.326

-

-

-

ChromeModa Solutions

Germany . 5,186 parts In-Stock

1+ parts

$57.475

100+ parts

$47.130

1k+ parts

-

10k+ parts

-

5,186

$57.475

$47.130

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-

IDEA Electronic Components Group

UK . 132 parts In-Stock

1+ parts

$57.475

100+ parts

$54.601

1k+ parts

$51.728

10k+ parts

-

132

$57.475

$54.601

$51.728

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Perfect Parts

USA . 279 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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279

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5310IRGZT microcontroller. As a trusted leader in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. Ideal for a wide range of applications, this microcontroller offers unparalleled performance and reliability. Take your projects to the next level with the MSP430F5310IRGZT and experience the quality, value, and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the microcontroller lightweight and durable, suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher power requirements without risking damage.

ADC Channels: YES

Having analog-to-digital converter channels allows for easy integration of sensors, making the microcontroller versatile in capturing real-world data.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency enables fast processing speeds, ideal for applications requiring quick response times.

Peripherals: BOD, CRC, COMPARATOR(4), DMA(3), PWM, RTC, TIMER(18), WDT

A wide range of peripherals like Watchdog Timer (WDT), Real-Time Clock (RTC), PWM channels, and more enhance the functionality and flexibility of the microcontroller.

ROM Programmability: FLASH

Flash programmability allows for easy updating and customization of the microcontroller's firmware, making it adaptable to different applications.

Low Power Mode: YES

The presence of a low power mode helps in reducing power consumption, making the microcontroller energy-efficient and suitable for battery-operated devices.

Technical Specifications

Microcontrollers MSP430F5310IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(4), UART

Peripherals:

BOD, CRC, COMPARATOR(4), DMA(3), PWM, RTC, TIMER(18), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5310IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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