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MSP430F5309IZQER

Texas Instruments

MSP430F5309IZQER by Texas Instruments

MSP430F5309IZQER by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 32 MHz. It features 8 ADC channels, 3 DMA channels, and offers low power mode for industrial applications requiring high-speed processing within a temperature range of -40 to 85°C.

Median Price

$1.840

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

$1.840

100+ parts

$1.800

1k+ parts

$1.770

10k+ parts

-

2,500

$1.840

$1.800

$1.770

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,590 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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7,590

-

-

-

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Digiode

USA . 4,464 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,464

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 612 parts In-Stock

1+ parts

$7.908

100+ parts

-

1k+ parts

-

10k+ parts

-

612

$7.908

-

-

-

One Stop Electronics

USA . 1,348 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

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1,348

$8.000

-

-

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Parana Technologies

USA . 2,008 parts In-Stock

1+ parts

$34.207

100+ parts

-

1k+ parts

$144.711

10k+ parts

-

2,008

$34.207

-

$144.711

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DigiPath Technology Company

USA . 891 parts In-Stock

1+ parts

$37.666

100+ parts

-

1k+ parts

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891

$37.666

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-

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ChromeModa Solutions

Germany . 4,869 parts In-Stock

1+ parts

$38.435

100+ parts

$31.517

1k+ parts

-

10k+ parts

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4,869

$38.435

$31.517

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IDEA Electronic Components Group

UK . 1,640 parts In-Stock

1+ parts

$38.435

100+ parts

$36.513

1k+ parts

$34.592

10k+ parts

-

1,640

$38.435

$36.513

$34.592

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$45.999

100+ parts

$41.859

1k+ parts

$37.719

10k+ parts

-

2,000

$45.999

$41.859

$37.719

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Component Stockers USA

USA . 765 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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765

$99.990

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Perfect Parts

USA . 8,615 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,615

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

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1,500

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Corphita

USA . 746 parts In-Stock

1+ parts

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746

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Microchip USA

USA . 199 parts In-Stock

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199

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Overview

Unlock the full potential of your electronic projects with the MSP430F5309IZQER by Texas Instruments, a high-quality microcontroller designed for a wide range of applications. With advanced technology and top-notch manufacturing from Texas Instruments, this device offers unmatched value and benefits to customers. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430F5309IZQER delivers exceptional performance and reliability. Experience innovation like never before with this powerful microcontroller at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

No. of Terminals: 80

Offers a high number of terminals for connectivity and expansion.

ADC Channels: YES

Enables analog to digital conversion for sensor integration.

ROM Words: 24576

Large ROM capacity for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient processing and reduced power consumption.

Analog To Digital Convertors: 8-Ch 10-Bit

Provides multiple channels for converting analog signals to digital data with high resolution.

Connectivity: "I2C, IRDA, SCI, SPI(2), UART(2)

Supports various communication protocols for versatile connectivity options.

Low Power Mode: YES

Includes low power modes for energy-efficient operation.

Technical Specifications

Microcontrollers MSP430F5309IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

18

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI, SPI(2), UART(2)"

Peripherals:

"BOD, COMPARATOR(16), CRC, DMA(3), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5309IZQER Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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