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MSP430F5309IRGZT

Texas Instruments

MSP430F5309IRGZT by Texas Instruments

MSP430F5309IRGZT by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 18 timers, and 8-channel ADC. Ideal for industrial applications due to -40 to 85 °C operating temp range. Features include low power mode, 6144 RAM bytes, and connectivity options like I2C, SPI, UART.

Median Price

$4.760

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,250 parts In-Stock

1+ parts

$3.783

100+ parts

$3.315

1k+ parts

$1.873

10k+ parts

-

8,250

$3.783

$3.315

$1.873

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DigiKey

USA . 379 parts In-Stock

1+ parts

$4.760

100+ parts

$3.022

1k+ parts

$2.873

10k+ parts

-

379

$4.760

$3.022

$2.873

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Mouser Electronics

USA . 206 parts In-Stock

1+ parts

$4.760

100+ parts

$3.030

1k+ parts

$2.770

10k+ parts

-

206

$4.760

$3.030

$2.770

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,583 parts In-Stock

1+ parts

$3.594

100+ parts

-

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-

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1,583

$3.594

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Vyrian

USA . 4,456 parts In-Stock

1+ parts

-

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4,456

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Bristol Electronics

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$1.871

1k+ parts

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120

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$1.871

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Dan-Mar Components

USA . 120 parts In-Stock

1+ parts

-

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120

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,189 parts In-Stock

1+ parts

$3.405

100+ parts

-

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3,189

$3.405

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Parana Technologies

USA . 1,133 parts In-Stock

1+ parts

$59.023

100+ parts

-

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1,133

$59.023

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DigiPath Technology Company

USA . 2,316 parts In-Stock

1+ parts

$64.992

100+ parts

$59.792

1k+ parts

-

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2,316

$64.992

$59.792

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ChromeModa Solutions

Germany . 5,303 parts In-Stock

1+ parts

$66.318

100+ parts

$54.381

1k+ parts

-

10k+ parts

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5,303

$66.318

$54.381

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IDEA Electronic Components Group

UK . 170 parts In-Stock

1+ parts

$66.318

100+ parts

$63.002

1k+ parts

$59.686

10k+ parts

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170

$66.318

$63.002

$59.686

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Perfect Parts

USA . 1,671 parts In-Stock

1+ parts

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1,671

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Overview

Unleash the power of innovation with the MSP430F5309IRGZT by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers cutting-edge solutions for a wide range of applications. The MSP430F5309IRGZT offers unparalleled quality and performance, with features like low power mode and a maximum clock frequency of 32 MHz. Its compact package and advanced peripherals make it ideal for industrial-grade projects. Experience the value and benefits of this product firsthand and take your designs to the next level with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material makes the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a wide range of voltage inputs.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it an efficient choice for energy-efficient applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and control of peripherals, enhancing overall performance.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast processing speeds, making the product suitable for applications requiring real-time responses.

ROM Programmability: FLASH

Flash programmability enables easy and quick updates to the software, enhancing flexibility and adaptability of the product.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADC channels with 10-bit resolution allow for accurate analog signal conversion, essential for sensor interfacing and data acquisition.

No. of DMA Channels: 3

DMA channels enable direct memory access for efficient data transfer, reducing CPU load and improving overall system performance.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(4), UART

Multiple communication interfaces provide versatility in connecting with other devices, expanding the product's compatibility and functionality.

Technical Specifications

Microcontrollers MSP430F5309IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(4), UART

Peripherals:

BOD, CRC, COMPARATOR(4), DMA(3), PWM, RTC, TIMER(18), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5309IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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