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MSP430F5309IRGCT

Texas Instruments

MSP430F5309IRGCT by Texas Instruments

MSP430F5309IRGCT by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 12-Ch 10-Bit ADC, and 18 timers. Ideal for industrial applications requiring low power consumption, it features 6144 RAM bytes, I2C/SPI/UART connectivity, and on-chip flash ROM programmability.

Median Price

$3.846

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,000 parts In-Stock

1+ parts

$3.846

100+ parts

$3.370

1k+ parts

$1.904

10k+ parts

-

4,000

$3.846

$3.370

$1.904

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,304 parts In-Stock

1+ parts

$3.654

100+ parts

-

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2,304

$3.654

-

-

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Vyrian

USA . 3,902 parts In-Stock

1+ parts

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3,902

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Chip Stock

USA . 3,700 parts In-Stock

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3,700

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

-

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-

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600

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,088 parts In-Stock

1+ parts

$3.270

100+ parts

$3.188

1k+ parts

$3.172

10k+ parts

-

2,088

$3.270

$3.188

$3.172

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Ampacity Inc.

Singapore . 2,000 parts In-Stock

1+ parts

$3.270

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-

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2,000

$3.270

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-

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Corphita

USA . 628 parts In-Stock

1+ parts

$3.461

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628

$3.461

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Corohmni

South Africa . 33 parts In-Stock

1+ parts

$22.797

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-

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33

$22.797

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Parana Technologies

USA . 284 parts In-Stock

1+ parts

$37.968

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284

$37.968

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DigiPath Technology Company

USA . 1,813 parts In-Stock

1+ parts

$41.808

100+ parts

$38.463

1k+ parts

-

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1,813

$41.808

$38.463

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ChromeModa Solutions

Germany . 5,221 parts In-Stock

1+ parts

$42.661

100+ parts

$34.982

1k+ parts

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5,221

$42.661

$34.982

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IDEA Electronic Components Group

UK . 379 parts In-Stock

1+ parts

$42.661

100+ parts

$40.528

1k+ parts

$38.395

10k+ parts

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379

$42.661

$40.528

$38.395

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Argo Parts USA

USA . 4,949 parts In-Stock

1+ parts

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4,949

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Continental Prestige Electronics

USA . 1,567 parts In-Stock

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1,567

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unlock the full potential of your projects with the MSP430F5309IRGCT microcontroller by Texas Instruments. Manufactured to the highest standards, this powerful device offers unmatched quality and reliability. Perfect for a wide range of applications, this microcontroller provides exceptional value by delivering efficient performance and innovative features. Experience the benefits of Texas Instruments' expertise in microcontrollers with the MSP430F5309IRGCT, and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers for its durability and resistance to heat and moisture, making the product reliable in various operating conditions.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can power more demanding applications without the risk of electrical damage.

ADC Channels: YES

Having Analog to Digital Converter channels enables the microcontroller to interface with analog sensors and signals, expanding its capabilities for a wider range of applications.

Maximum Clock Frequency: 32 MHz

The high clock frequency allows for faster processing speeds and response times, making the microcontroller suitable for time-sensitive tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a Reduced Instruction Set Computing (RISC) architecture, this microcontroller offers efficient and streamlined operations for optimized performance.

Technical Specifications

Microcontrollers MSP430F5309IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(4), UART

Peripherals:

BOD, CRC, COMPARATOR(8), DMA(3), PWM, RTC, TIMER(18), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5309IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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