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MSP430F5308IRGZR

Texas Instruments

MSP430F5308IRGZR by Texas Instruments

MSP430F5308IRGZR by Texas Instruments is a 16-bit microcontroller with 3.6V max supply voltage, 32MHz clock frequency, and 18 timers. Ideal for industrial applications requiring low power consumption, it features 8-Ch ADCs, 3 DMA channels, and various peripherals like PWM and UART for connectivity.

Median Price

$2.260

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,950 parts In-Stock

1+ parts

$2.640

100+ parts

$2.313

1k+ parts

$1.307

10k+ parts

-

7,950

$2.640

$2.313

$1.307

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Rochester

USA . 96 parts In-Stock

1+ parts

-

100+ parts

$1.880

1k+ parts

$1.680

10k+ parts

$1.580

96

-

$1.880

$1.680

$1.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,668 parts In-Stock

1+ parts

$1.729

100+ parts

-

1k+ parts

-

10k+ parts

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1,668

$1.729

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Vyrian

USA . 7,904 parts In-Stock

1+ parts

-

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7,904

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-

-

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Prism Electronics

USA . 1,710 parts In-Stock

1+ parts

-

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1,710

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,220 parts In-Stock

1+ parts

$1.638

100+ parts

-

1k+ parts

-

10k+ parts

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1,220

$1.638

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AZTECH Wire

Italy . 752 parts In-Stock

1+ parts

$21.150

100+ parts

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752

$21.150

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-

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Parana Technologies

USA . 2,375 parts In-Stock

1+ parts

$51.159

100+ parts

-

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2,375

$51.159

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DigiPath Technology Company

USA . 1,221 parts In-Stock

1+ parts

$56.332

100+ parts

$51.826

1k+ parts

-

10k+ parts

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1,221

$56.332

$51.826

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ChromeModa Solutions

Germany . 1,948 parts In-Stock

1+ parts

$57.482

100+ parts

$47.135

1k+ parts

-

10k+ parts

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1,948

$57.482

$47.135

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IDEA Electronic Components Group

UK . 348 parts In-Stock

1+ parts

$57.482

100+ parts

$54.608

1k+ parts

$51.734

10k+ parts

-

348

$57.482

$54.608

$51.734

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Overview

Unlock the potential of your next project with the Texas Instruments MSP430F5308IRGZR microcontroller. Known for their high-quality products, Texas Instruments delivers unmatched reliability and performance. Ideal for a wide range of applications, this microcontroller offers customers value and benefits like low power consumption, advanced peripherals, and fast clock frequency. Whether you're designing IoT devices, industrial controls, or consumer electronics, the MSP430F5308IRGZR provides the features and capabilities you need to bring your ideas to life. Choose Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments and applications.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options, giving flexibility in designing and operating the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

This RISC-based microcontroller architecture allows for efficient processing and execution of instructions, enhancing overall performance.

Maximum Clock Frequency: 32 MHz

Enables high-speed operation and processing capability, making it suitable for applications requiring quick response times.

Analog To Digital Convertors: 8-Ch 10-Bit

Having multiple ADC channels with 10-bit resolution allows for accurate analog signal sampling and processing, essential for many applications.

Technical Specifications

Microcontrollers MSP430F5308IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(4), UART

Peripherals:

BOD, CRC, COMPARATOR(4), DMA(3), PWM, RTC, TIMER(18), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5308IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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