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MSP430F5258IZQER

Texas Instruments

MSP430F5258IZQER by Texas Instruments

MSP430F5258IZQER by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 32 RAM words. It operates at a max frequency of 32 MHz, suitable for industrial applications requiring up to 54 I/O lines and connectivity via USCI. The package style is grid array with very thin profile, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,920 parts In-Stock

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Digiode

USA . 3,309 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 320 parts In-Stock

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$5.415

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One Stop Electronics

USA . 363 parts In-Stock

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$21.000

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Parana Technologies

USA . 1,259 parts In-Stock

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$53.120

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ChromeModa Solutions

Germany . 423 parts In-Stock

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$59.685

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$48.942

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IDEA Electronic Components Group

UK . 294 parts In-Stock

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$59.685

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$56.701

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$53.716

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294

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$53.716

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DigiPath Technology Company

USA . 292 parts In-Stock

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$53.812

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Microchip USA

USA . 144 parts In-Stock

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Corphita

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F5258IZQER microcontroller. Designed for excellence, this product offers unparalleled quality and reliability, making it a top choice for a wide range of applications. With advanced features like ADC channels, DMA channels, and PWM channels, this microcontroller delivers exceptional performance and flexibility. Trust in Texas Instruments' expertise to provide cutting-edge technology that exceeds expectations. Experience the value and benefits of the MSP430F5258IZQER and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the microcontroller suitable for various applications while reducing overall weight.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle more complex computational tasks and operate faster than lower bit size microcontrollers.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels allows for accurate and efficient conversion of analog signals to digital data, enabling sensor interfacing and measurement applications.

Maximum Clock Frequency: 32 MHz

The high clock frequency enables fast execution of instructions, making the microcontroller suitable for applications that require quick processing and response times.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and convenient updating of firmware, enabling the microcontroller to adapt to changing requirements and new features.

RAM Bytes: 32768

Having a large RAM size enables the microcontroller to store and process a significant amount of data, improving performance and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various input/output voltage levels, making the microcontroller energy-efficient and versatile.

Technical Specifications

Microcontrollers MSP430F5258IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Trade Compliance

MSP430F5258IZQER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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