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MSP430F5258IRGCR

Texas Instruments

MSP430F5258IRGCR by Texas Instruments

MSP430F5258IRGCR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 32 RAM words. It operates at a max frequency of 32 MHz, suitable for industrial applications requiring up to 53 I/O lines and connectivity through USCI. The chip's compact size, low power consumption, and integrated peripherals like ADC and DMA make it ideal for embedded systems in various industries.

Median Price

$4.353

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,646 parts In-Stock

1+ parts

$4.353

100+ parts

$3.549

1k+ parts

$2.366

10k+ parts

-

8,646

$4.353

$3.549

$2.366

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,236 parts In-Stock

1+ parts

$4.135

100+ parts

-

1k+ parts

-

10k+ parts

-

3,236

$4.135

-

-

-

Vyrian

USA . 4,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,696

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,954 parts In-Stock

1+ parts

$3.918

100+ parts

-

1k+ parts

-

10k+ parts

-

1,954

$3.918

-

-

-

AZTECH Wire

Italy . 912 parts In-Stock

1+ parts

$11.530

100+ parts

-

1k+ parts

-

10k+ parts

-

912

$11.530

-

-

-

Parana Technologies

USA . 2,252 parts In-Stock

1+ parts

$24.710

100+ parts

-

1k+ parts

$25.376

10k+ parts

-

2,252

$24.710

-

$25.376

-

DigiPath Technology Company

USA . 815 parts In-Stock

1+ parts

$27.209

100+ parts

$25.032

1k+ parts

-

10k+ parts

-

815

$27.209

$25.032

-

-

ChromeModa Solutions

Germany . 2,995 parts In-Stock

1+ parts

$27.764

100+ parts

$22.766

1k+ parts

-

10k+ parts

-

2,995

$27.764

$22.766

-

-

IDEA Electronic Components Group

UK . 2,062 parts In-Stock

1+ parts

$27.764

100+ parts

$26.376

1k+ parts

$24.988

10k+ parts

-

2,062

$27.764

$26.376

$24.988

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QUARKTWIN TECHNOLOGY LTD

USA . 6,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,480

-

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F5258IRGCR microcontroller. With a reputation for high-quality products, Texas Instruments delivers top-notch performance and reliability. Ideal for a wide range of applications, this microcontroller offers customers unparalleled value with its advanced features and capabilities. Experience the benefits of seamless connectivity, efficient power management, and versatile peripherals. Elevate your projects with the MSP430F5258IRGCR and unleash your creativity today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the product lightweight and durable.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power input options and compatibility with various power sources.

Bit Size: 16

Provides sufficient processing power and capability for handling complex tasks.

RAM Bytes: 32768

Ample RAM capacity enables efficient and fast data processing.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for speedy operation and real-time responsiveness.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures optimized performance and efficiency in executing instructions.

Technical Specifications

Microcontrollers MSP430F5258IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Trade Compliance

MSP430F5258IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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