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MSP430F5256IZQE

Texas Instruments

MSP430F5256IZQE by Texas Instruments

MSP430F5256IZQE by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It features 54 I/O lines, 32 MHz clock frequency, and peripherals like DMA(3) and RTC. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,682 parts In-Stock

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Digiode

USA . 2,040 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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AZTECH Wire

Italy . 825 parts In-Stock

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$16.806

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Ampacity Inc.

Singapore . 1,648 parts In-Stock

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$25.000

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One Stop Electronics

USA . 1,010 parts In-Stock

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$34.000

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Parana Technologies

USA . 758 parts In-Stock

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$35.280

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758

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ChromeModa Solutions

Germany . 1,535 parts In-Stock

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$39.640

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$32.505

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$39.640

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IDEA Electronic Components Group

UK . 1,516 parts In-Stock

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$39.640

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$37.658

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$35.676

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$35.676

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Corohmni

South Africa . 138 parts In-Stock

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$72.284

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Continental Prestige Electronics

USA . 4,453 parts In-Stock

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Argo Parts USA

USA . 2,215 parts In-Stock

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Corphita

USA . 1,538 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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DigiPath Technology Company

USA . 451 parts In-Stock

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$35.739

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$35.739

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Microchip USA

USA . 330 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the MSP430F5256IZQE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and reliable. This innovative product offers a wide range of applications in various industries, providing customers with exceptional value and performance. With features such as high-speed processing, advanced connectivity options, and energy-efficient design, the MSP430F5256IZQE is the perfect solution for your next project. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable and affordable.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options.

Bit Size: 16

A 16-bit size offers sufficient processing power for many applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data accurately.

RAM Words: 16

Although small, 16 RAM words provide temporary data storage for efficient processing.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers faster execution of instructions, making the microcontroller efficient in performing tasks.

PWM Channels: YES

PWM channels allow for precise control of output signals, suitable for applications requiring modulation.

ROM Programmability: FLASH

FLASH programmability allows for easy and fast reprogramming of the ROM, enhancing flexibility in application development.

Technical Specifications

Microcontrollers MSP430F5256IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Trade Compliance

MSP430F5256IZQE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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