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MSP430F5256IRGCT

Texas Instruments

MSP430F5256IRGCT by Texas Instruments

MSP430F5256IRGCT by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It operates at a max frequency of 32 MHz, suitable for industrial applications requiring up to 53 I/O lines and connectivity through USCI.

Median Price

$5.352

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,115 parts In-Stock

1+ parts

$6.147

100+ parts

$5.012

1k+ parts

$3.341

10k+ parts

-

3,115

$6.147

$5.012

$3.341

-

Rochester

USA . 2,750 parts In-Stock

1+ parts

-

100+ parts

$4.170

1k+ parts

$3.730

10k+ parts

$3.510

2,750

-

$4.170

$3.730

$3.510

DigiKey

USA . 2,750 parts In-Stock

1+ parts

-

100+ parts

$5.490

1k+ parts

-

10k+ parts

-

2,750

-

$5.490

-

-

Verical

USA . 2,750 parts In-Stock

1+ parts

-

100+ parts

$5.213

1k+ parts

$4.662

10k+ parts

$4.388

2,750

-

$5.213

$4.662

$4.388

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,225 parts In-Stock

1+ parts

$4.408

100+ parts

-

1k+ parts

-

10k+ parts

-

2,225

$4.408

-

-

-

Vyrian

USA . 8,013 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,013

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,500 parts In-Stock

1+ parts

$3.940

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$3.940

-

-

-

Corphita

USA . 177 parts In-Stock

1+ parts

$4.176

100+ parts

-

1k+ parts

-

10k+ parts

-

177

$4.176

-

-

-

Component Stockers USA

USA . 8,316 parts In-Stock

1+ parts

$4.780

100+ parts

$4.500

1k+ parts

$3.610

10k+ parts

-

8,316

$4.780

$4.500

$3.610

-

Microchip USA

USA . 1,301 parts In-Stock

1+ parts

$16.060

100+ parts

$15.830

1k+ parts

$15.720

10k+ parts

$15.600

1,301

$16.060

$15.830

$15.720

$15.600

Parana Technologies

USA . 2,018 parts In-Stock

1+ parts

$44.447

100+ parts

-

1k+ parts

-

10k+ parts

-

2,018

$44.447

-

-

-

DigiPath Technology Company

USA . 1,439 parts In-Stock

1+ parts

$48.941

100+ parts

-

1k+ parts

-

10k+ parts

-

1,439

$48.941

-

-

-

ChromeModa Solutions

Germany . 5,768 parts In-Stock

1+ parts

$49.940

100+ parts

$40.951

1k+ parts

-

10k+ parts

-

5,768

$49.940

$40.951

-

-

IDEA Electronic Components Group

UK . 755 parts In-Stock

1+ parts

$49.940

100+ parts

$47.443

1k+ parts

$44.946

10k+ parts

-

755

$49.940

$47.443

$44.946

-

Overview

Experience the cutting-edge technology of the MSP430F5256IRGCT microcontroller by Texas Instruments, a trusted leader in the industry. With its versatile applications and high-quality design, this product offers unparalleled value to customers looking for reliable performance and efficiency. Whether you need it for industrial automation, consumer electronics, or IoT devices, this microcontroller delivers advanced features like ADC and DMA channels, PWM support, and multiple peripherals. Trust Texas Instruments to provide the innovative solutions you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good insulation, making the microcontroller less susceptible to damage and interference.

Surface Mount: YES

Surface mount technology allows for smaller footprint and easier assembly, making the product suitable for compact designs.

Maximum Supply Voltage: 3.6 V

The higher supply voltage allows for compatibility with a wide range of power sources, increasing flexibility in application.

Package Shape: SQUARE

Square shape allows for efficient use of board space and easy alignment during assembly.

Bit Size: 16

16-bit architecture provides higher processing power and data handling capabilities compared to 8-bit microcontrollers.

No. of Terminals: 64

More terminals allow for greater connectivity options and interface capabilities with other components.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in various environmental conditions.

CPU Family: MSP430

MSP430 family is known for low power consumption and high-performance characteristics, making it an efficient choice for battery-powered devices.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme cold environments without compromising performance.

ADC Channels: YES

Integrated ADC channels enable analog signal conversion, providing versatility in sensing and measurement applications.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speed and efficiency, reducing CPU workload for improved system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers streamlined instruction execution and higher speed operation, making the microcontroller suitable for real-time processing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the microcontroller.

Nominal Supply Voltage: 3 V

Stable supply voltage ensures consistent and reliable operation of the microcontroller in a variety of applications.

Technical Specifications

Microcontrollers MSP430F5256IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Trade Compliance

MSP430F5256IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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