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MSP430F5255IZQE

Texas Instruments

MSP430F5255IZQE by Texas Instruments

MSP430F5255IZQE by Texas Instruments is a Microcontroller with 131072 ROM words and 32 RAM words. With a compact size of 5x5 mm, it's ideal for applications requiring low power consumption and high performance in a small form factor. Its RISC CPU family and CMOS technology make it suitable for various embedded systems projects.

Median Price

$3.237

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 720 parts In-Stock

1+ parts

-

100+ parts

$2.740

1k+ parts

$2.450

10k+ parts

$2.300

720

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$2.740

$2.450

$2.300

DigiKey

USA . 720 parts In-Stock

1+ parts

-

100+ parts

$3.600

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-

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720

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$3.600

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Verical

USA . 720 parts In-Stock

1+ parts

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$3.237

10k+ parts

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720

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$3.237

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,802 parts In-Stock

1+ parts

$2.888

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1,802

$2.888

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Vyrian

USA . 8,954 parts In-Stock

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8,954

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DigiKey Marketplace

USA . 720 parts In-Stock

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720

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,989 parts In-Stock

1+ parts

$2.736

100+ parts

-

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2,989

$2.736

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Component Stockers USA

USA . 1,101 parts In-Stock

1+ parts

$3.120

100+ parts

$2.920

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-

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1,101

$3.120

$2.920

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Parana Technologies

USA . 2,322 parts In-Stock

1+ parts

$58.736

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2,322

$58.736

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DigiPath Technology Company

USA . 1,207 parts In-Stock

1+ parts

$64.675

100+ parts

$59.501

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1,207

$64.675

$59.501

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IDEA Electronic Components Group

UK . 1,389 parts In-Stock

1+ parts

$65.995

100+ parts

$62.695

1k+ parts

$59.396

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-

1,389

$65.995

$62.695

$59.396

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ChromeModa Solutions

Germany . 795 parts In-Stock

1+ parts

$65.995

100+ parts

$54.116

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795

$65.995

$54.116

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Microchip USA

USA . 362 parts In-Stock

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362

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Overview

Unlock a world of endless possibilities with the MSP430F5255IZQE microcontroller from Texas Instruments. Designed with precision and expertise, this powerful device offers unparalleled performance and reliability in a compact package. Whether you're a seasoned developer or a DIY enthusiast, this microcontroller is perfect for a wide range of applications, from IoT devices to industrial automation. Trust in Texas Instruments to deliver cutting-edge technology that will take your projects to the next level. Experience the value and innovation this microcontroller brings to your work.

Feature Benefit Bullets

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making this microcontroller a great choice for battery-powered applications.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish ensures good conductivity and resistance to corrosion, increasing the reliability and longevity of the product.

ROM Words: 131072

With a large ROM capacity of 131072 words, this microcontroller can accommodate complex programs and data, making it suitable for a wide range of applications.

Maximum Seated Height: 1 mm

The low seated height of 1 mm allows for compact designs and saves space in electronic devices where size constraints are important.

RAM Words: 32

While the RAM capacity of 32 words may seem low, it is sufficient for many embedded applications and helps to keep costs down without sacrificing performance.

Width: 5 mm

The narrow width of 5 mm makes this microcontroller suitable for applications where space is limited, such as in small IoT devices or wearables.

Maximum Time At Peak Reflow Temperature (s): 30

The short peak reflow temperature time of 30 seconds ensures that the microcontroller is not exposed to high temperatures for an extended period, reducing the risk of damage during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering during assembly processes, ensuring strong connections and long-term stability.

Length: 5 mm

The compact length of 5 mm complements the narrow width, making this microcontroller ideal for space-constrained applications where size and performance are crucial.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller enables efficient and fast processing of instructions, making it suitable for real-time applications and tasks that require high computational performance.

Technology: CMOS

The CMOS technology used in this microcontroller ensures low power consumption and high noise immunity, making it ideal for battery-powered devices and applications in noisy environments.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and compact PCB designs, enabling the use of this microcontroller in small and portable electronic devices.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microcontroller can withstand moderate exposure to humidity during storage and assembly processes, ensuring reliability in various environmental conditions.

Technical Specifications

Microcontrollers MSP430F5255IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

CPU Family:

MSP430

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

RAM Words:

32

ROM Words:

131072

Maximum Seated Height:

1 mm

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Pitch:

.5 mm

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

MSP430F5255IZQE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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