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MSP430F5254IRGCR

Texas Instruments

MSP430F5254IRGCR by Texas Instruments

MSP430F5254IRGCR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 32 RAM words. It operates at a max frequency of 32 MHz, suitable for industrial applications requiring up to 53 I/O lines and connectivity through USCI. The chip carrier package style with a very thin profile makes it ideal for compact designs in various electronic devices.

Median Price

$4.302

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 36,791 parts In-Stock

1+ parts

$4.353

100+ parts

$3.549

1k+ parts

$2.366

10k+ parts

-

36,791

$4.353

$3.549

$2.366

-

Rochester

USA . 663 parts In-Stock

1+ parts

-

100+ parts

$3.400

1k+ parts

$3.040

10k+ parts

$2.860

663

-

$3.400

$3.040

$2.860

DigiKey

USA . 663 parts In-Stock

1+ parts

-

100+ parts

$4.470

1k+ parts

-

10k+ parts

-

663

-

$4.470

-

-

Verical

USA . 663 parts In-Stock

1+ parts

-

100+ parts

$4.250

1k+ parts

$3.800

10k+ parts

$3.575

663

-

$4.250

$3.800

$3.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 430 parts In-Stock

1+ parts

$3.126

100+ parts

-

1k+ parts

-

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430

$3.126

-

-

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Vyrian

USA . 7,450 parts In-Stock

1+ parts

-

100+ parts

-

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-

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7,450

-

-

-

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DigiKey Marketplace

USA . 663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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663

-

-

-

-

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

-

100+ parts

-

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200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,544 parts In-Stock

1+ parts

$2.800

100+ parts

-

1k+ parts

-

10k+ parts

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9,544

$2.800

-

-

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Corphita

USA . 2,772 parts In-Stock

1+ parts

$2.961

100+ parts

-

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2,772

$2.961

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-

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Corohmni

South Africa . 326 parts In-Stock

1+ parts

$41.255

100+ parts

-

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326

$41.255

-

-

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Parana Technologies

USA . 1,562 parts In-Stock

1+ parts

$54.836

100+ parts

-

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1,562

$54.836

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-

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DigiPath Technology Company

USA . 2,352 parts In-Stock

1+ parts

$60.382

100+ parts

-

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2,352

$60.382

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ChromeModa Solutions

Germany . 2,074 parts In-Stock

1+ parts

$61.614

100+ parts

$50.523

1k+ parts

-

10k+ parts

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2,074

$61.614

$50.523

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IDEA Electronic Components Group

UK . 1,237 parts In-Stock

1+ parts

$61.614

100+ parts

$58.533

1k+ parts

$55.453

10k+ parts

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1,237

$61.614

$58.533

$55.453

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Continental Prestige Electronics

USA . 4,014 parts In-Stock

1+ parts

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4,014

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Argo Parts USA

USA . 2,010 parts In-Stock

1+ parts

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2,010

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Aranea Global

USA . 50 parts In-Stock

1+ parts

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50

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Overview

Enhance your projects with the MSP430F5254IRGCR by Texas Instruments, a top-quality microcontroller designed to meet your needs. With a wide range of applications in various industries, this innovative product offers unmatched value and benefits. Manufactured by Texas Instruments, known for their reliable and cutting-edge technology, this microcontroller ensures high performance and efficiency. Whether you're looking to improve connectivity, enhance automation, or streamline processes, the MSP430F5254IRGCR is the perfect solution for all your project requirements. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the microcontroller from external elements.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options for various applications.

Package Shape: SQUARE

Enables efficient use of space on the circuit board.

Bit Size: 16

Offers a good balance between processing power and energy efficiency.

No. of Terminals: 64

Provides sufficient connections for external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers various mounting options to suit different design requirements.

Minimum Supply Voltage: 2.4 V

Allows for operation in low-power applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

CPU Family: MSP430

This family is known for its low-power consumption and high performance, making it a popular choice for many applications.

Minimum Operating Temperature: -40 °C

Ensures the microcontroller can operate in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and electrical conductivity for reliable connections.

ADC Channels: YES

Allows for analog input, making the microcontroller versatile for various sensing applications.

DMA Channels: YES

Enables efficient data transfers without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Facilitates easy routing of connections on the circuit board.

ROM Words: 131072

Offers ample space for program storage.

Maximum Seated Height: 1 mm

Enables compact designs in space-constrained applications.

RAM Words: 32

Provides temporary storage for data processing, enhancing the microcontroller's performance.

Width: 9 mm

Compact size makes it suitable for small electronic devices.

Peripherals: COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

A wide range of peripherals enhances the microcontroller's functionality for diverse applications.

Maximum Clock Frequency: 32 MHz

Allows for high-speed processing of instructions.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

Indicates the maximum temperature the microcontroller can withstand during soldering.

Length: 9 mm

Compact size makes it suitable for small electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency in processing instructions.

RAM Bytes: 32768

Provides ample memory for data storage and fast access during operation.

Technology: CMOS

Offers low power consumption and high noise immunity for reliable operation.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and ensure soldering integrity.

Nominal Supply Voltage: 3 V

Standard voltage level for compatibility with various power sources.

PWM Channels: YES

Enables precise control of analog signals for applications like motor control and LED dimming.

Connectivity: USCI(8)

Multiple communication interfaces facilitate connectivity with external devices for data exchange.

ROM Programmability: FLASH

Flash memory allows for easy reprogrammability of the microcontroller.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density mounting on the circuit board.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring reliability in humid environments.

Speed: 32 rpm

Indicates the processing speed of the microcontroller.

On Chip Program ROM Width: 8

Wide ROM width accommodates larger program codes for complex applications.

No. of I/O Lines: 53

Offers ample input/output connections for interfacing with external components.

Technical Specifications

Microcontrollers MSP430F5254IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Trade Compliance

MSP430F5254IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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