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MSP430F5247IRGCT

Texas Instruments

MSP430F5247IRGCT by Texas Instruments

MSP430F5247IRGCT by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 12-Ch 10-Bit ADC channels and offers low power mode, suitable for industrial applications requiring high-speed processing and connectivity via IRDA, I2C, SPI, and UART interfaces.

Median Price

$4.296

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,000 parts In-Stock

1+ parts

$4.973

100+ parts

$4.358

1k+ parts

$2.462

10k+ parts

-

1,000

$4.973

$4.358

$2.462

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.619

10k+ parts

-

250

-

-

$3.619

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 948 parts In-Stock

1+ parts

$4.724

100+ parts

-

1k+ parts

-

10k+ parts

-

948

$4.724

-

-

-

Vyrian

USA . 7,956 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,956

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,066 parts In-Stock

1+ parts

$4.476

100+ parts

-

1k+ parts

-

10k+ parts

-

1,066

$4.476

-

-

-

Component Stockers USA

USA . 1,844 parts In-Stock

1+ parts

$6.390

100+ parts

$4.700

1k+ parts

$2.620

10k+ parts

-

1,844

$6.390

$4.700

$2.620

-

Microchip USA

USA . 1,545 parts In-Stock

1+ parts

$29.900

100+ parts

$29.720

1k+ parts

$29.630

10k+ parts

$29.530

1,545

$29.900

$29.720

$29.630

$29.530

Parana Technologies

USA . 2,204 parts In-Stock

1+ parts

$42.303

100+ parts

-

1k+ parts

-

10k+ parts

-

2,204

$42.303

-

-

-

DigiPath Technology Company

USA . 459 parts In-Stock

1+ parts

$46.581

100+ parts

$42.855

1k+ parts

-

10k+ parts

-

459

$46.581

$42.855

-

-

IDEA Electronic Components Group

UK . 1,934 parts In-Stock

1+ parts

$47.532

100+ parts

$45.155

1k+ parts

$42.779

10k+ parts

-

1,934

$47.532

$45.155

$42.779

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ChromeModa Solutions

Germany . 1,090 parts In-Stock

1+ parts

$47.532

100+ parts

$38.976

1k+ parts

-

10k+ parts

-

1,090

$47.532

$38.976

-

-

Overview

Unlock endless possibilities with the MSP430F5247IRGCT microcontroller from Texas Instruments. Designed with precision and expertise, this versatile chip offers unparalleled performance in a compact package. Perfect for a wide range of applications, this microcontroller boasts advanced features such as low power mode, connectivity options like IRDA and SPI, and a robust set of peripherals. Trust in Texas Instruments to deliver quality and reliability with the MSP430F5247IRGCT, providing you with the tools you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the microcontroller suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power requirements and compatibility with a wide range of voltage inputs.

Bit Size: 16

Provides a good balance between performance and power efficiency for most applications.

No. of External Interrupts: 16

Enables efficient handling of external events and interrupts, improving the responsiveness of the microcontroller.

ADC Channels: YES

Allows for analog signal processing and conversion, expanding the range of applications that the microcontroller can be used for.

Peripherals: BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT

Offers a wide range of built-in peripherals that can enhance the functionality and capabilities of the microcontroller in various applications.

Maximum Clock Frequency: 32 MHz

Provides high processing speed and performance, making the microcontroller suitable for real-time applications and tasks.

ROM Programmability: FLASH

Allows for easy reprogrammability and updating of firmware, reducing development time and effort.

Connectivity: IRDA, I2C, SPI(2), UART

Supports a variety of communication protocols, enabling easy integration with other components and devices in a system.

Technical Specifications

Microcontrollers MSP430F5247IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

53

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5247IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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