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MSP430F5242IRGZR

Texas Instruments

MSP430F5242IRGZR by Texas Instruments

MSP430F5242IRGZR by Texas Instruments is a 16-bit microcontroller with 48 terminals, operating at a max frequency of 32 MHz. It features 10 ADC channels, 3 DMA channels, and peripherals like BOR, CRC, and PWM. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$3.420

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 20,821 parts In-Stock

1+ parts

$3.420

100+ parts

$2.997

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$1.693

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20,821

$3.420

$2.997

$1.693

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Distributors (In-Stock)

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Digiode

USA . 683 parts In-Stock

1+ parts

$3.249

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683

$3.249

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Vyrian

USA . 8,543 parts In-Stock

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8,543

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Nova Conductors

Japan . 76 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,598 parts In-Stock

1+ parts

$3.078

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1,598

$3.078

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Ampacity Inc.

Singapore . 20,385 parts In-Stock

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$6.330

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20,385

$6.330

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AZTECH Wire

Italy . 795 parts In-Stock

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$9.180

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795

$9.180

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Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$12.281

100+ parts

$11.176

1k+ parts

$10.070

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650

$12.281

$11.176

$10.070

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Parana Technologies

USA . 556 parts In-Stock

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$74.911

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556

$74.911

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DigiPath Technology Company

USA . 815 parts In-Stock

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$82.487

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815

$82.487

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ChromeModa Solutions

Germany . 6,672 parts In-Stock

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$84.170

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$69.019

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6,672

$84.170

$69.019

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IDEA Electronic Components Group

UK . 2,227 parts In-Stock

1+ parts

$84.170

100+ parts

$79.962

1k+ parts

$75.753

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2,227

$84.170

$79.962

$75.753

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Continental Prestige Electronics

USA . 3,018 parts In-Stock

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Argo Parts USA

USA . 2,114 parts In-Stock

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A-Z Elektronik GmbH

Germany . 191 parts In-Stock

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Bastille Electronics

Australia . 99 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F5242IRGZR microcontroller. With its cutting-edge technology and reliable performance, this product is a game-changer in the world of microcontrollers. Ideal for a variety of applications, this device offers unparalleled value and benefits to customers looking for high-quality solutions. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430F5242IRGZR has got you covered. Experience the difference with Texas Instruments and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while operating within a safe voltage range.

No. of External Interrupts: 16

Provides the ability to respond to external events quickly and efficiently, enhancing real-time processing capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for efficient and streamlined processing, maximizing performance.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor (CMOS) technology for low power consumption and high noise immunity, ideal for battery-operated applications.

Speed: 25 rpm

Operates at a speed of 25 rotations per minute, suitable for applications requiring precise control and timing.

Technical Specifications

Microcontrollers MSP430F5242IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

MSP430F5242IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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