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MSP430F5227IRGCR

Texas Instruments

MSP430F5227IRGCR by Texas Instruments

MSP430F5227IRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 8192 bytes of RAM, FLASH ROM programmability, and ADC/DMA channels. Ideal for industrial applications requiring low power consumption and high performance in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,904 parts In-Stock

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Digiode

USA . 1,813 parts In-Stock

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1,813

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Distributors (Availability)

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AZTECH Wire

Italy . 623 parts In-Stock

1+ parts

$7.315

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623

$7.315

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One Stop Electronics

USA . 1,426 parts In-Stock

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$34.000

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$34.000

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Parana Technologies

USA . 1,692 parts In-Stock

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$35.128

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1,692

$35.128

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DigiPath Technology Company

USA . 1,063 parts In-Stock

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$38.681

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$35.586

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1,063

$38.681

$35.586

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ChromeModa Solutions

Germany . 2,984 parts In-Stock

1+ parts

$39.470

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$32.365

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2,984

$39.470

$32.365

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IDEA Electronic Components Group

UK . 1,847 parts In-Stock

1+ parts

$39.470

100+ parts

$37.496

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$35.523

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1,847

$39.470

$37.496

$35.523

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Corphita

USA . 3,598 parts In-Stock

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Microchip USA

USA . 232 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F5227IRGCR Microcontroller. Trusted for its superior quality and innovative technology, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This microcontroller offers unparalleled value, providing customers with efficient performance, reliability, and flexibility. With features like ADC channels, PWM channels, and ROM programmability, this product is designed to meet all your needs. Experience the next level of control and optimization with the MSP430F5227IRGCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power requirements and compatibility with a variety of applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, maximizing the number of components that can be integrated.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle complex tasks and calculations with precision and efficiency.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages enables the microcontroller to be used in a variety of voltage environments, increasing its versatility.

No. of Terminals: 64

The large number of terminals allow for a wide range of input and output connections, expanding the capabilities of the microcontroller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles provide options for different mounting and cooling requirements, making it adaptable to various use cases.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures efficient power usage and extends the range of applications in which the microcontroller can be used.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and operate reliably in demanding applications.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with existing platforms and software, simplifying development and integration processes.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows the microcontroller to be used in extreme cold environments without sacrificing performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the microcontroller.

ADC Channels: YES

The presence of analog-to-digital converter channels allows the microcontroller to interface with analog sensors and signals, expanding its capabilities.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer without CPU intervention, improving overall system performance and multitasking capabilities.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and connection to the circuit board, making assembly and maintenance simpler and more reliable.

ROM Words: 32768

The large ROM capacity allows for storing a significant amount of program code and data, enabling complex applications and algorithms to be executed.

Maximum Seated Height: 1 mm

The low seated height of the package minimizes the overall profile of the microcontroller, making it suitable for compact and space-constrained designs.

Width: 9 mm

The compact width of the microcontroller package allows for efficient placement and routing on the circuit board, optimizing space utilization.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency ensures fast processing and real-time responsiveness, making the microcontroller suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required at peak reflow temperature during assembly minimizes the risk of heat-related damage to the microcontroller, ensuring product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering and assembly processes without compromising the integrity of the microcontroller.

Length: 9 mm

The compact length of the microcontroller package contributes to space efficiency and flexibility in design, making it suitable for various form factors.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures reliable operation in harsh environmental conditions and industrial applications, enhancing product durability.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller allows for fast and efficient execution of instructions, enhancing overall performance and responsiveness.

RAM Bytes: 8192

The ample RAM capacity enables efficient data storage and manipulation, supporting multitasking and memory-intensive applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, improving energy efficiency and reliability.

Terminal Form: NO LEAD

The lead-free terminal form is environmentally friendly and complies with RoHS regulations, making the microcontroller a sustainable and responsible choice.

Maximum Supply Current: 11 mA

The low maximum supply current requirement minimizes power consumption and heat generation, contributing to energy efficiency and cost savings.

Nominal Supply Voltage: 3 V

The standardized nominal supply voltage simplifies power management and compatibility with other components, ensuring seamless integration into electronic systems.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog signals and motor speeds, enhancing the microcontroller's versatility for various applications.

ROM Programmability: FLASH

The Flash ROM programmability allows for easy and secure firmware updates, enabling flexibility and scalability in software development and maintenance.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for higher pin density and more compact packaging, facilitating smaller and more efficient PCB designs.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level ensures proper handling and storage of the microcontroller to prevent damage during manufacturing and assembly processes.

Speed: 25 rpm

The rotational speed of 25 revolutions per minute (rpm) indicates the efficient performance and responsiveness of the microcontroller in handling tasks and processing data.

No. of I/O Lines: 53

The ample number of input/output lines provide flexibility in interfacing with external devices and peripherals, enhancing the connectivity and functionality of the microcontroller.

Technical Specifications

Microcontrollers MSP430F5227IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

MSP430F5227IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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