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MSP430F5222IRGZR

Texas Instruments

MSP430F5222IRGZR by Texas Instruments

MSP430F5222IRGZR by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 3.6V max supply voltage, and 37 I/O lines. Ideal for industrial applications requiring low power consumption, it features ADC/DMA channels, PWM support, and connectivity options like I2C/SPI/UART.

Median Price

$3.503

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,781 parts In-Stock

1+ parts

$3.503

100+ parts

$3.069

1k+ parts

$1.734

10k+ parts

-

5,781

$3.503

$3.069

$1.734

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,312 parts In-Stock

1+ parts

$3.328

100+ parts

-

1k+ parts

-

10k+ parts

-

2,312

$3.328

-

-

-

Vyrian

USA . 6,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,660

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 720 parts In-Stock

1+ parts

$3.153

100+ parts

-

1k+ parts

-

10k+ parts

-

720

$3.153

-

-

-

Microchip USA

USA . 2,146 parts In-Stock

1+ parts

$15.140

100+ parts

$15.050

1k+ parts

$15.000

10k+ parts

$14.950

2,146

$15.140

$15.050

$15.000

$14.950

AZTECH Wire

Italy . 433 parts In-Stock

1+ parts

$17.460

100+ parts

-

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433

$17.460

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-

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Parana Technologies

USA . 405 parts In-Stock

1+ parts

$25.317

100+ parts

-

1k+ parts

$25.940

10k+ parts

-

405

$25.317

-

$25.940

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DigiPath Technology Company

USA . 1,940 parts In-Stock

1+ parts

$27.877

100+ parts

$25.647

1k+ parts

-

10k+ parts

-

1,940

$27.877

$25.647

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-

ChromeModa Solutions

Germany . 3,565 parts In-Stock

1+ parts

$28.446

100+ parts

$23.326

1k+ parts

-

10k+ parts

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3,565

$28.446

$23.326

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IDEA Electronic Components Group

UK . 1,766 parts In-Stock

1+ parts

$28.446

100+ parts

$27.024

1k+ parts

$25.601

10k+ parts

-

1,766

$28.446

$27.024

$25.601

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Futuretech Components

Singapore . 830 parts In-Stock

1+ parts

-

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830

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Overview

Unlock the power of innovation with the MSP430F5222IRGZR microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. This microcontroller is perfect for a wide range of applications, offering exceptional performance and reliability. Experience seamless connectivity with I2C, IRDA, SCI, SPI, and UART interfaces. With low power modes and flash ROM programmability, the MSP430F5222IRGZR provides unmatched value and flexibility. Stay ahead of the curve with this versatile and efficient microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the microcontroller chip.

Maximum Supply Voltage: 3.6 V

Allows for a higher operating voltage range, offering flexibility in power supply options.

Bit Size: 16

Having a 16-bit architecture enables the microcontroller to handle more complex operations and data compared to lower bit sizes.

No. of Terminals: 48

Having a higher number of terminals allows for more connectivity options and peripherals to be interfaced with the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture typically results in faster execution of instructions and better performance efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Speed: 25 rpm

Operating at a speed of 25 rpm allows for faster processing of data and instructions, improving overall performance.

No. of I/O Lines: 37

Having a high number of I/O lines enables versatile input and output functionality for interfacing with external devices.

Technical Specifications

Microcontrollers MSP430F5222IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

37

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Connectivity:

"I2C, IRDA, SCI(3), SPI(2), UART"

Trade Compliance

MSP430F5222IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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