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MSP430F5217IYFFR

Texas Instruments

MSP430F5217IYFFR by Texas Instruments

MSP430F5217IYFFR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 8KB of RAM and 65,536 ROM words, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SCI(3), SPI(2), UART interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,680 parts In-Stock

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3,680

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Vyrian

USA . 2,862 parts In-Stock

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2,862

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Distributors (Availability)

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AZTECH Wire

Italy . 828 parts In-Stock

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$12.093

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828

$12.093

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Microchip USA

USA . 3,678 parts In-Stock

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$18.782

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One Stop Electronics

USA . 464 parts In-Stock

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$22.000

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464

$22.000

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Parana Technologies

USA . 2,005 parts In-Stock

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$50.921

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$4,728.820

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$45.829

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2,005

$50.921

$4,728.820

$45.829

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DigiPath Technology Company

USA . 1,664 parts In-Stock

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$56.071

100+ parts

$51.585

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1,664

$56.071

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ChromeModa Solutions

Germany . 5,937 parts In-Stock

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$57.215

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$46.916

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5,937

$57.215

$46.916

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IDEA Electronic Components Group

UK . 1,394 parts In-Stock

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$57.215

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$54.354

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$51.494

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$51.494

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Corphita

USA . 4,023 parts In-Stock

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Overview

Unleash the power of innovation with the MSP430F5217IYFFR by Texas Instruments. As a leader in microcontrollers, Texas Instruments guarantees top-notch quality and reliability. This versatile device is perfect for a wide range of applications, offering customers unmatched value and benefits. With advanced features like multiple ADC channels, DMA channels, and PWM channels, the MSP430F5217IYFFR delivers exceptional performance while consuming minimal power. Experience seamless connectivity with I2C, IRDA, SCI, SPI, and UART interfaces. Elevate your projects to new heights with the MSP430F5217IYFFR and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for portable devices.

Maximum Supply Voltage: 3.6 V

Allows for a higher maximum supply voltage, providing flexibility in power supply options.

Bit Size: 16

The 16-bit size allows for processing larger data chunks efficiently, enhancing overall performance.

No. of Terminals: 64

With 64 terminals, there are ample connectivity options for interfaces and peripherals.

ADC Channels: YES

The presence of ADC channels enables analog to digital conversion, supporting diverse sensor integration.

ROM Words: 65536

With 65536 ROM words, the microcontroller can store a significant amount of program data for complex applications.

Maximum Clock Frequency: 32 MHz

A high maximum clock frequency of 32 MHz allows for fast processing speeds and responsive operation.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient instruction execution and reduced power consumption.

No. of I/O Lines: 53

The 53 I/O lines provide extensive input and output capabilities, supporting versatile connectivity options.

Technical Specifications

Microcontrollers MSP430F5217IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e1

Length:

3.535 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

53

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.415 mm

Peripheral IC Type:

Connectivity:

"I2C, IRDA, SCI(3), SPI(2), UART"

Trade Compliance

MSP430F5217IYFFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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