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MSP430F5214IRGZT

Texas Instruments

MSP430F5214IRGZT by Texas Instruments

MSP430F5214IRGZT by Texas Instruments is a 16-bit microcontroller with 48 terminals, operating at up to 32 MHz. It features 8192 bytes of RAM, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,104 parts In-Stock

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Digiode

USA . 2,156 parts In-Stock

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One Stop Electronics

USA . 1,028 parts In-Stock

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$7.000

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$7.000

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AZTECH Wire

Italy . 233 parts In-Stock

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$15.787

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Parana Technologies

USA . 758 parts In-Stock

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$38.187

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DigiPath Technology Company

USA . 1,826 parts In-Stock

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$42.049

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$38.685

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1,826

$42.049

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ChromeModa Solutions

Germany . 4,268 parts In-Stock

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$42.907

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$35.184

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$42.907

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IDEA Electronic Components Group

UK . 1,302 parts In-Stock

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$42.907

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$40.762

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$38.616

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$42.907

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$38.616

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Corphita

USA . 2,804 parts In-Stock

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Microchip USA

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F5214IRGZT microcontroller. Designed with precision and innovation, this powerful device is perfect for a wide range of applications. Whether you're looking to streamline your industrial processes, enhance your smart home devices, or create cutting-edge wearable technology, this microcontroller offers unmatched performance and reliability. Experience seamless integration, low power consumption, and advanced features that bring your ideas to life. Choose Texas Instruments for quality you can trust and technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body helps in reducing the overall weight of the microcontroller, making it a lightweight and portable option.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of voltage inputs, making it versatile for different electrical applications.

Bit Size: 16

The 16-bit size allows for more complex arithmetic operations and data processing, making this microcontroller suitable for applications that require higher computational power.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals, making it ideal for applications that require analog-to-digital conversion.

ROM Words: 65536

The large ROM size of 65536 words provides ample space for storing program instructions and data, making this microcontroller suitable for more complex applications.

RAM Bytes: 8192

With 8192 bytes of RAM, this microcontroller can efficiently handle data storage and processing tasks, making it suitable for applications that require dynamic memory allocation.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency of 32 MHz allows for fast execution of instructions, making this microcontroller ideal for applications that require high-speed processing.

PWM Channels: YES

The presence of PWM channels enables the microcontroller to generate pulse-width modulated signals, which is essential for controlling motors, LEDs, and other devices in a precise manner.

Technical Specifications

Microcontrollers MSP430F5214IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

37

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSP430F5214IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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