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MSP430F5212IRGZR

Texas Instruments

MSP430F5212IRGZR by Texas Instruments

MSP430F5212IRGZR by Texas Instruments is a 16-bit microcontroller with 32 MHz max clock frequency, 37 I/O lines, and 8192 bytes of RAM. Ideal for industrial applications, it operates b/w -40 to 85 °C with a supply voltage range of 2.4-3.6 V. It features ADC and DMA channels for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,527 parts In-Stock

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Digiode

USA . 3,096 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 400 parts In-Stock

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$9.877

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$9.877

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One Stop Electronics

USA . 1,464 parts In-Stock

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$15.000

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Parana Technologies

USA . 2,235 parts In-Stock

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$19.262

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$1,788.794

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$17.336

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$1,788.794

$17.336

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DigiPath Technology Company

USA . 1,908 parts In-Stock

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$21.210

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ChromeModa Solutions

Germany . 4,096 parts In-Stock

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$21.643

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$17.747

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$21.643

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IDEA Electronic Components Group

UK . 93 parts In-Stock

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$21.643

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$20.561

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$19.479

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$21.643

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Microchip USA

USA . 7,479 parts In-Stock

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Corphita

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Overview

Unlock the potential of your projects with the Texas Instruments MSP430F5212IRGZR microcontroller. With a reputation for quality and innovation, Texas Instruments delivers cutting-edge technology that meets the demands of today's applications. Whether you're designing IoT devices, consumer electronics, or industrial automation systems, this microcontroller offers value, efficiency, and reliability. Experience the benefits of seamless integration, low power consumption, and high performance. Elevate your designs with the MSP430F5212IRGZR and stay ahead in the fast-paced world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Provides flexibility in powering the microcontroller safely within a wide voltage range.

Bit Size: 16

Offers a good balance between performance and power consumption for various applications.

Power Supplies (V): 2/3.3

Compatibility with multiple power supply options for versatility in different system designs.

No. of Terminals: 48

Sufficient terminals for interfacing with various components and peripherals in a system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package style options for different mounting and heat dissipation requirements.

Minimum Supply Voltage: 2.4 V

Ensures reliable operation even at lower voltage levels for power efficiency.

Maximum Operating Temperature: 85 °C

Can operate in a wide temperature range, suitable for industrial applications.

CPU Family: MSP430

Belongs to a reputable CPU family known for efficiency and reliability in microcontroller applications.

Minimum Operating Temperature: -40 °C

Ideal for use in environments with low temperatures without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Built-in Analog-to-Digital Converter for precise analog signal processing.

DMA Channels: YES

Direct Memory Access support for efficient data transfer and processing.

Terminal Position: QUAD

Quad position terminals for compact design and ease of PCB layout.

ROM Words: 32768

Sufficient ROM capacity for storing program instructions and data.

Maximum Seated Height: 1 mm

Low profile design for compact and space-saving applications.

Width: 7 mm

Compact width for fitting in tight spaces on PCBs.

Maximum Clock Frequency: 32 MHz

High clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes.

Length: 7 mm

Compact length for efficient space utilization on PCBs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and optimized performance in microcontroller applications.

RAM Bytes: 8192

A good amount of RAM for data storage and processing in various applications.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for environmental compliance and reliability.

Maximum Supply Current: 11 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Pulse Width Modulation support for precise control of connected devices.

ROM Programmability: FLASH

Flash memory for easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design and high-density PCB layout.

Moisture Sensitivity Level (MSL): 3

MSL level 3 for handling and storage in standard factory environments.

Speed: 25 rpm

Operates at a moderate speed suitable for a wide range of applications.

No. of I/O Lines: 37

Plenty of I/O lines for connecting and controlling external devices.

Technical Specifications

Microcontrollers MSP430F5212IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

37

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSP430F5212IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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