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MSP430F5152IYFFT

Texas Instruments

MSP430F5152IYFFT by Texas Instruments

MSP430F5152IYFFT by Texas Instruments is a 16-bit microcontroller with 40 terminals, operating at up to 32 MHz. It features 9 ADC channels, 3 DMA channels, and peripherals like BOR, CRC, and PWM. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$4.082

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,950 parts In-Stock

1+ parts

$3.404

100+ parts

$2.982

1k+ parts

$1.685

10k+ parts

-

3,950

$3.404

$2.982

$1.685

-

DigiKey

USA . 375 parts In-Stock

1+ parts

$4.760

100+ parts

$3.022

1k+ parts

$2.873

10k+ parts

-

375

$4.760

$3.022

$2.873

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,554 parts In-Stock

1+ parts

$3.234

100+ parts

-

1k+ parts

-

10k+ parts

-

1,554

$3.234

-

-

-

Vyrian

USA . 8,698 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,698

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,283 parts In-Stock

1+ parts

$3.064

100+ parts

-

1k+ parts

-

10k+ parts

-

1,283

$3.064

-

-

-

Microchip USA

USA . 2,205 parts In-Stock

1+ parts

$20.460

100+ parts

$20.340

1k+ parts

$20.280

10k+ parts

$20.210

2,205

$20.460

$20.340

$20.280

$20.210

Parana Technologies

USA . 730 parts In-Stock

1+ parts

$25.631

100+ parts

-

1k+ parts

$26.238

10k+ parts

-

730

$25.631

-

$26.238

-

DigiPath Technology Company

USA . 564 parts In-Stock

1+ parts

$28.223

100+ parts

-

1k+ parts

-

10k+ parts

-

564

$28.223

-

-

-

ChromeModa Solutions

Germany . 6,324 parts In-Stock

1+ parts

$28.799

100+ parts

$23.615

1k+ parts

-

10k+ parts

-

6,324

$28.799

$23.615

-

-

IDEA Electronic Components Group

UK . 738 parts In-Stock

1+ parts

$28.799

100+ parts

$27.359

1k+ parts

$25.919

10k+ parts

-

738

$28.799

$27.359

$25.919

-

Overview

Enhance your electronic projects with the MSP430F5152IYFFT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that offer unparalleled performance and reliability. With applications ranging from consumer electronics to industrial automation, this product provides value and benefits like low power consumption, high-speed operation, and versatile connectivity options. Trust Texas Instruments to provide you with cutting-edge technology that will take your designs to the next level. Upgrade your projects today with the MSP430F5152IYFFT!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and flexibility in design, making the product suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

Allows for a higher operating voltage range, providing flexibility in power supply options.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style allows for compact and space-saving designs, making it ideal for applications where size is a concern.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture offers efficient processing performance, making the microcontroller suitable for a wide range of applications requiring high-speed operation.

ADC Channels: YES

The presence of ADC channels allows for analog input readings, enabling the microcontroller to interface with sensors and other analog devices.

RAM Bytes: 2048

The large amount of RAM allows for efficient data storage and manipulation, making the microcontroller suitable for complex applications.

Connectivity: I2C, SPI(2), UART

Multiple communication interfaces provide flexibility in connecting the microcontroller to other devices, enhancing its versatility in diverse applications.

Speed: 25 rpm

The high speed capability of 25 rpm enables the microcontroller to process data quickly, making it suitable for real-time applications where fast responses are required.

Technical Specifications

Microcontrollers MSP430F5152IYFFT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B40

JESD-609 Code:

e1

Length:

3.06 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of I/O Lines:

31

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA40,6X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

25 rpm

Maximum Supply Current:

6.15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.76 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Analog To Digital Convertors:

9-Ch 10-Bit

Trade Compliance

MSP430F5152IYFFT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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