Loading...

MSP430F5151IYFFR

Texas Instruments

MSP430F5151IYFFR by Texas Instruments

MSP430F5151IYFFR by Texas Instruments is a 16-bit microcontroller with 16384 ROM words, 2048 RAM bytes, and 31 I/O lines. It operates at a max clock frequency of 32 MHz and features peripherals like BOR, CRC, and PWM. Ideal for industrial applications requiring low power consumption and connectivity via I2C, SPI, and UART interfaces.

Median Price

$2.836

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,647 parts In-Stock

1+ parts

$2.836

100+ parts

$2.485

1k+ parts

$1.404

10k+ parts

-

5,647

$2.836

$2.485

$1.404

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 153 parts In-Stock

1+ parts

$2.694

100+ parts

-

1k+ parts

-

10k+ parts

-

153

$2.694

-

-

-

Vyrian

USA . 2,937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,937

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,859 parts In-Stock

1+ parts

$2.552

100+ parts

-

1k+ parts

-

10k+ parts

-

3,859

$2.552

-

-

-

AZTECH Wire

Italy . 1,036 parts In-Stock

1+ parts

$8.410

100+ parts

-

1k+ parts

-

10k+ parts

-

1,036

$8.410

-

-

-

Microchip USA

USA . 5,962 parts In-Stock

1+ parts

$12.776

100+ parts

-

1k+ parts

-

10k+ parts

-

5,962

$12.776

-

-

-

Parana Technologies

USA . 2,231 parts In-Stock

1+ parts

$57.689

100+ parts

$5,357.290

1k+ parts

$51.920

10k+ parts

-

2,231

$57.689

$5,357.290

$51.920

-

DigiPath Technology Company

USA . 1,943 parts In-Stock

1+ parts

$63.523

100+ parts

-

1k+ parts

-

10k+ parts

-

1,943

$63.523

-

-

-

ChromeModa Solutions

Germany . 6,839 parts In-Stock

1+ parts

$64.819

100+ parts

$53.152

1k+ parts

-

10k+ parts

-

6,839

$64.819

$53.152

-

-

IDEA Electronic Components Group

UK . 525 parts In-Stock

1+ parts

$64.819

100+ parts

$61.578

1k+ parts

$58.337

10k+ parts

-

525

$64.819

$61.578

$58.337

-

Overview

Unlock the power of cutting-edge technology with the MSP430F5151IYFFR microcontroller from Texas Instruments. Designed with precision and quality in mind, this microcontroller offers unmatched performance and reliability for a wide range of applications. With advanced features like ADC channels, DMA channels, and peripherals like PWM and timers, this product is the perfect choice for industrial-grade projects requiring high-speed processing and low power consumption. Experience seamless connectivity with I2C, SPI, and UART interfaces, all in a compact package that maximizes efficiency without compromising on functionality. Elevate your designs to the next level with the MSP430F5151IYFFR and revolutionize the way you approach microcontroller-based projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring protection for the microcontroller and making it suitable for various applications.

Bit Size: 16

16-bit processing capability allows for higher precision and more complex calculations, making it suitable for advanced applications.

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast processing speeds, ideal for tasks requiring quick response times.

RAM Bytes: 2048

Ample RAM storage capacity for temporary data storage, allowing for efficient multitasking and handling of large datasets.

Connectivity: I2C, SPI(2), UART

Multiple connectivity options provide flexibility for interfacing with other devices, enhancing the microcontroller's versatility.

Low Power Mode: YES

Low power mode feature helps in conserving energy, making it suitable for battery-powered applications and reducing overall power consumption.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and convenient firmware updates, enabling adaptability to changing requirements without the need for external programming hardware.

Technical Specifications

Microcontrollers MSP430F5151IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B40

JESD-609 Code:

e1

Length:

3.06 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of I/O Lines:

31

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA40,6X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

25 rpm

Maximum Supply Current:

6.15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.76 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Trade Compliance

MSP430F5151IYFFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20