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MSP430F479IPNR

Texas Instruments

MSP430F479IPNR by Texas Instruments

MSP430F479IPNR by Texas Instruments is a 16-bit microcontroller with 1024 RAM words and 61440 ROM words. It operates at a max clock frequency of 8 MHz, suitable for industrial applications requiring low power consumption and multiple peripherals like LCD, RTC, and timers. With ADC and DAC channels, it offers versatile connectivity through I2C, SPI, and UART interfaces.

Median Price

$8.586

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,480 parts In-Stock

1+ parts

$8.586

100+ parts

$7.499

1k+ parts

$5.172

10k+ parts

-

19,480

$8.586

$7.499

$5.172

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,393 parts In-Stock

1+ parts

$8.157

100+ parts

-

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-

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4,393

$8.157

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Vyrian

USA . 6,864 parts In-Stock

1+ parts

-

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6,864

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Chip Stock

USA . 5,860 parts In-Stock

1+ parts

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5,860

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Technoshack Inc.

Canada . 250 parts In-Stock

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,773 parts In-Stock

1+ parts

$7.727

100+ parts

-

1k+ parts

-

10k+ parts

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1,773

$7.727

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AZTECH Wire

Italy . 648 parts In-Stock

1+ parts

$20.850

100+ parts

-

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648

$20.850

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Parana Technologies

USA . 1,574 parts In-Stock

1+ parts

$70.903

100+ parts

-

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1,574

$70.903

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DigiPath Technology Company

USA . 1,684 parts In-Stock

1+ parts

$78.073

100+ parts

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1k+ parts

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1,684

$78.073

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IDEA Electronic Components Group

UK . 1,792 parts In-Stock

1+ parts

$79.666

100+ parts

$75.683

1k+ parts

$71.699

10k+ parts

-

1,792

$79.666

$75.683

$71.699

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ChromeModa Solutions

Germany . 1,464 parts In-Stock

1+ parts

$79.666

100+ parts

$65.326

1k+ parts

-

10k+ parts

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1,464

$79.666

$65.326

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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Perfect Parts

USA . 1,512 parts In-Stock

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1,512

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F479IPNR Microcontroller. Designed with precision and quality in mind, this versatile device offers a wide range of applications, from IoT to consumer electronics. With its advanced features and cutting-edge technology, this microcontroller delivers unmatched performance and reliability. Experience seamless connectivity, low power consumption, and superior functionality that will take your projects to the next level. Choose Texas Instruments for unparalleled value and excellence in microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for smaller and lighter designs, making the product suitable for compact applications.

Maximum Supply Voltage: 3.6 V

A higher supply voltage allows for more flexibility in power requirements and can accommodate a wider range of peripherals.

On Chip Data RAM Width: 16

A wider data RAM width allows for faster data processing and improved performance.

Package Shape: SQUARE

Square packages are easier to handle and provide better thermal performance, making them a practical choice for microcontrollers.

Bit Size: 16

A 16-bit architecture allows for higher processing speeds and greater data handling capabilities.

DAC Channels: YES

Digital-to-analog converters enable the microcontroller to interface with analog devices, expanding its functionality.

Power Supplies (V): 2/3.3

Multiple power supply options provide flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 80

Having a high number of terminals allows for more connectivity options and I/O capabilities.

Package Style (Meter): FLATPACK

Flatpack packages offer a low-profile design and efficient heat dissipation, improving overall system reliability.

Minimum Supply Voltage: 2.5 V

A low minimum supply voltage ensures energy efficiency and can extend battery life in portable applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and operate reliably in industrial settings.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it a popular choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

A wide operating temperature range allows the microcontroller to function in both extreme cold and hot temperatures, ensuring versatility in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity, corrosion resistance, and solderability, enhancing the reliability and longevity of the product.

ADC Channels: YES

Analog-to-digital converters enable the microcontroller to convert analog signals into digital data, expanding its sensor interfacing capabilities.

Terminal Position: QUAD

Quad terminal positioning offers increased stability and mechanical strength, making it suitable for rugged applications.

ROM Words: 61440

With a large ROM capacity, the microcontroller can store extensive program code and data, allowing for complex software applications.

Maximum Seated Height: 1.6 mm

A low seated height facilitates compact PCB designs and reduces overall system profile, ideal for space-constrained applications.

Digital To Analog Convertors: 1-Ch 12-Bit

A 12-bit DAC provides high-resolution analog output, enabling precise control and accurate signal generation in audio and instrumentation applications.

RAM Words: 1024

A sufficient RAM capacity allows for efficient data storage and manipulation, ensuring smooth operation and multitasking capabilities.

Width: 12 mm

A compact width dimension saves space on the PCB and accommodates tighter layout constraints in small electronic devices.

Boundary Scan: YES

Boundary scan testing simplifies manufacturing and debugging processes, enhancing product quality and reliability.

Peripherals: BROWN-OUT DETECT, COMPARATOR, LCD, RTC, TIMER(2), WDT

A wide range of built-in peripherals expands the functionality of the microcontroller, offering versatile capabilities for diverse application requirements.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency supports fast data processing and real-time operation, meeting the performance demands of modern embedded systems.

Maximum Time At Peak Reflow Temperature (s): 30

A short reflow time minimizes thermal stress on the component during assembly, ensuring reliable solder joints and component integrity.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the microcontroller can withstand lead-free soldering processes without compromising its performance or reliability.

Length: 12 mm

A moderate length dimension offers a balance between space efficiency and component accessibility on the PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature ratings ensure reliable operation in harsh environments with wide temperature variations, making the microcontroller suitable for robust applications.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC-based microcontroller architecture offers enhanced performance, lower power consumption, and efficient code execution, ideal for embedded control applications.

No. of Timers: 2

Having multiple timers enables the microcontroller to handle timing-critical tasks, synchronization, and event management, enhancing system control capabilities.

RAM Bytes: 2048

A generous RAM size allows for smooth data processing, multitasking, and efficient memory management, improving overall system performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable operation, making it suitable for battery-powered and portable devices.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and mechanical strength, reducing the risk of solder joint failure in harsh operating conditions.

Analog To Digital Convertors: 5-Ch 16-Bit

Five 16-bit ADC channels offer high-resolution analog signal acquisition, enabling precise monitoring and control of multiple sensors in industrial automation and data acquisition systems.

Maximum Supply Current: 0.46 mA

Low supply current consumption ensures energy efficiency and extends battery life in power-sensitive applications, making the microcontroller economically viable.

Nominal Supply Voltage: 3 V

A stable 3V supply voltage ensures consistent and reliable operation of the microcontroller across a wide range of operating conditions.

PWM Channels: YES

Pulse-width modulation (PWM) channels support precise control of connected devices like motors, LEDs, and heaters, offering versatile output options for various applications.

Connectivity: I2C, SPI(2), UART

Multiple communication interfaces (I2C, SPI, UART) facilitate seamless connectivity with external peripherals, enabling data exchange and control in diverse system configurations.

ROM Programmability: FLASH

Flash programmable memory allows for easy firmware updates, quick prototyping, and flexible reprogramming options without the need for external programming tools.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5mm offers high pin density and reduces PCB footprint, allowing for compact and space-efficient board designs.

Format: FIXED POINT

Fixed-point arithmetic simplifies numerical computations, reduces computational overhead, and optimizes processing speed in embedded control applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the microcontroller's ability to withstand moderate exposure to moisture during storage and handling, ensuring reliable performance in non-extreme humidity conditions.

Speed: 8 RPM

With a speed of 8 RPM (Revolutions Per Minute), the microcontroller meets the processing speed requirements of most embedded applications, providing efficient data handling and control.

Low Power Mode: YES

The low power mode option reduces power consumption during idle or standby periods, extending battery life and improving energy efficiency in power-sensitive applications.

Technical Specifications

Microcontrollers MSP430F479IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Serial I/Os:

1

No. of Terminals:

80

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.46 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BROWN-OUT DETECT, COMPARATOR, LCD, RTC, TIMER(2), WDT

Analog To Digital Convertors:

5-Ch 16-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

MSP430F479IPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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