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MSP430F4793IPZ

Texas Instruments

MSP430F4793IPZ by Texas Instruments

MSP430F4793IPZ by Texas Instruments is a 16-bit microcontroller with 10-Ch 10-Bit ADC, 2.5k RAM, and 61440 ROM words. Ideal for industrial applications due to its low power mode, peripherals like BOD and LCD, and connectivity options including I2C, SPI, and UART. Operating temperature range from -40 to 85 °C with a max clock frequency of 16 MHz.

Median Price

$9.380

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,909 parts In-Stock

1+ parts

$9.380

100+ parts

$7.647

1k+ parts

$5.098

10k+ parts

-

1,909

$9.380

$7.647

$5.098

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,634 parts In-Stock

1+ parts

$8.911

100+ parts

-

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-

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3,634

$8.911

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Vyrian

USA . 1,594 parts In-Stock

1+ parts

$9.380

100+ parts

-

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-

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1,594

$9.380

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Zilex Electronics Inc.

Canada . 90 parts In-Stock

1+ parts

-

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90

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

iBuyXS LLC

. 8,000 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

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8,000

$6.000

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-

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Corphita

USA . 3,502 parts In-Stock

1+ parts

$8.442

100+ parts

-

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3,502

$8.442

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AZTECH Wire

Italy . 782 parts In-Stock

1+ parts

$10.140

100+ parts

-

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782

$10.140

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Parana Technologies

USA . 1,887 parts In-Stock

1+ parts

$76.918

100+ parts

-

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1,887

$76.918

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-

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DigiPath Technology Company

USA . 1,002 parts In-Stock

1+ parts

$84.696

100+ parts

$77.921

1k+ parts

-

10k+ parts

-

1,002

$84.696

$77.921

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ChromeModa Solutions

Germany . 3,300 parts In-Stock

1+ parts

$86.425

100+ parts

$70.868

1k+ parts

-

10k+ parts

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3,300

$86.425

$70.868

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IDEA Electronic Components Group

UK . 1,541 parts In-Stock

1+ parts

$86.425

100+ parts

$82.104

1k+ parts

$77.782

10k+ parts

-

1,541

$86.425

$82.104

$77.782

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Infinite Electronics LLP (Excess)

. 27,697 parts In-Stock

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27,697

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BidChips

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$6.000

10k+ parts

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8,000

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$6.000

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A-Z Elektronik GmbH

Germany . 4,752 parts In-Stock

1+ parts

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4,752

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Overview

Unlock the full potential of your electronic projects with the Texas Instruments MSP430F4793IPZ microcontroller. Designed with cutting-edge technology and precision engineering, this versatile device offers seamless integration, low power consumption, and high performance for a wide range of applications. From industrial automation to consumer electronics, the MSP430F4793IPZ delivers unmatched reliability and efficiency, making it the perfect choice for your next project. Experience the difference with Texas Instruments and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it provides good insulation and protection for the internal components.

Integrated Cache: YES

Having integrated cache helps in improving the performance of the microcontroller by allowing faster access to frequently used data.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a range of systems.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle larger data sizes and perform more complex operations compared to lower bit architectures.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications where temperature variations are common.

No. of Timers: 7

Having multiple timers allows for precise timing control in various applications such as scheduling tasks, generating waveforms, and measuring time intervals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it a suitable choice for applications requiring efficiency and reliability.

Technical Specifications

Microcontrollers MSP430F4793IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3 V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2560

RAM Words:

2.5

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(4), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, LCD, TIMER(7), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

MSP430F4793IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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