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MSP430F478IPN

Texas Instruments

MSP430F478IPN by Texas Instruments

MSP430F478IPN by Texas Instruments is a 16-bit microcontroller with 2048 bytes of RAM and 49152 ROM words. It operates at a max clock frequency of 8 MHz, suitable for industrial applications requiring low power consumption and connectivity through USCI(2) interface. With DAC and ADC channels, it offers versatile analog-to-digital conversion capabilities.

Median Price

$15.232

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,620 parts In-Stock

1+ parts

$10.734

100+ parts

$9.376

1k+ parts

$6.466

10k+ parts

-

1,620

$10.734

$9.376

$6.466

-

Mouser Electronics

USA . 59 parts In-Stock

1+ parts

$19.730

100+ parts

$15.290

1k+ parts

$12.250

10k+ parts

-

59

$19.730

$15.290

$12.250

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,435 parts In-Stock

1+ parts

$10.197

100+ parts

-

1k+ parts

-

10k+ parts

-

2,435

$10.197

-

-

-

Vyrian

USA . 2,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,635

-

-

-

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Holdelec - ElecDif-Pro

France . 39 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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39

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,773 parts In-Stock

1+ parts

$9.661

100+ parts

-

1k+ parts

-

10k+ parts

-

3,773

$9.661

-

-

-

Microchip USA

USA . 2,141 parts In-Stock

1+ parts

$29.810

100+ parts

$29.380

1k+ parts

$29.170

10k+ parts

$28.950

2,141

$29.810

$29.380

$29.170

$28.950

Parana Technologies

USA . 2,327 parts In-Stock

1+ parts

$37.584

100+ parts

-

1k+ parts

-

10k+ parts

-

2,327

$37.584

-

-

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ChromeModa Solutions

Germany . 6,995 parts In-Stock

1+ parts

$42.229

100+ parts

$34.628

1k+ parts

-

10k+ parts

-

6,995

$42.229

$34.628

-

-

IDEA Electronic Components Group

UK . 1,521 parts In-Stock

1+ parts

$42.229

100+ parts

$40.118

1k+ parts

$38.006

10k+ parts

-

1,521

$42.229

$40.118

$38.006

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DigiPath Technology Company

USA . 890 parts In-Stock

1+ parts

-

100+ parts

$38.074

1k+ parts

-

10k+ parts

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890

-

$38.074

-

-

Perfect Parts

USA . 666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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666

-

-

-

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F478IPN microcontroller. Crafted with precision and expertise, this versatile device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value, efficiency, and flexibility. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the MSP430F478IPN and experience the difference that quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and light-weight material suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

Bit Size: 16

Higher bit size allows for more precise calculations and operations.

DAC Channels: YES

Ability to convert digital signal to analog, increasing versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing and control tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Low Power Mode: YES

Enables energy-efficient operation for battery-powered devices.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of signals.

Technical Specifications

Microcontrollers MSP430F478IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

80

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.46 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

USCI(2)

Peripherals:

BOD, COMPARATOR, LCD, RTC, TIMER(6), WDT

Analog To Digital Convertors:

1-Ch 16-Bit

Digital To Analog Convertors:

1-Ch 12-bit

Trade Compliance

MSP430F478IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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