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MSP430F477IZCAR

Texas Instruments

MSP430F477IZCAR by Texas Instruments

MSP430F477IZCAR by Texas Instruments is a 16-bit microcontroller with 113 terminals, operating at up to 8 MHz. It features 1-Ch 12-bit DAC and 5-Ch 16-Bit ADC channels, suitable for industrial applications requiring low power consumption and connectivity via I2C, SPI, and UART interfaces.

Median Price

$9.802

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,189 parts In-Stock

1+ parts

$9.802

100+ parts

$7.991

1k+ parts

$5.327

10k+ parts

-

12,189

$9.802

$7.991

$5.327

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$5.327

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$5.327

-

-

-

Digiode

USA . 1,619 parts In-Stock

1+ parts

$9.312

100+ parts

-

1k+ parts

-

10k+ parts

-

1,619

$9.312

-

-

-

Vyrian

USA . 7,809 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,809

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$5.327

100+ parts

$5.061

1k+ parts

$4.808

10k+ parts

$4.741

1,000

$5.327

$5.061

$4.808

$4.741

Ampacity Inc.

Singapore . 12,132 parts In-Stock

1+ parts

$8.330

100+ parts

-

1k+ parts

-

10k+ parts

-

12,132

$8.330

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-

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Corphita

USA . 1,278 parts In-Stock

1+ parts

$8.822

100+ parts

-

1k+ parts

-

10k+ parts

-

1,278

$8.822

-

-

-

AZTECH Wire

Italy . 823 parts In-Stock

1+ parts

$12.410

100+ parts

-

1k+ parts

-

10k+ parts

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823

$12.410

-

-

-

Microchip USA

USA . 1,255 parts In-Stock

1+ parts

$19.280

100+ parts

$19.010

1k+ parts

$18.870

10k+ parts

$18.730

1,255

$19.280

$19.010

$18.870

$18.730

Parana Technologies

USA . 158 parts In-Stock

1+ parts

$38.905

100+ parts

-

1k+ parts

-

10k+ parts

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158

$38.905

-

-

-

DigiPath Technology Company

USA . 1,015 parts In-Stock

1+ parts

$42.839

100+ parts

-

1k+ parts

-

10k+ parts

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1,015

$42.839

-

-

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ChromeModa Solutions

Germany . 6,850 parts In-Stock

1+ parts

$43.713

100+ parts

$35.845

1k+ parts

-

10k+ parts

-

6,850

$43.713

$35.845

-

-

IDEA Electronic Components Group

UK . 1,243 parts In-Stock

1+ parts

$43.713

100+ parts

$41.527

1k+ parts

$39.342

10k+ parts

-

1,243

$43.713

$41.527

$39.342

-

Overview

Unlock the power of innovation with the MSP430F477IZCAR microcontroller by Texas Instruments. Designed with precision and quality in mind, this versatile device offers a wide range of applications in various industries. From its low power mode to its advanced peripherals like ADC and DAC channels, this microcontroller delivers exceptional performance and reliability. Experience seamless connectivity with I2C, SPI, and UART interfaces, all housed in a compact package for easy integration. Trust in Texas Instruments for cutting-edge technology that propels your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for efficient PCB assembly and saves space, making the product ideal for compact designs.

Maximum Supply Voltage: 3.6 V

The ability to operate at a higher voltage provides flexibility in power supply options for the product.

On Chip Data RAM Width: 16

With a wide data RAM width, the product can handle larger data sets efficiently.

Package Shape: SQUARE

Square package shape is more compact and saves space on the PCB, making it suitable for small form factor designs.

Bit Size: 16

16-bit architecture allows for higher precision and processing capabilities, making the product suitable for demanding applications.

DAC Channels: YES

Digital-to-analog converters enable the product to interface with analog components, expanding its compatibility and functionality.

No. of Terminals: 113

The high number of terminals offers versatile connectivity options for peripherals and external devices.

Minimum Supply Voltage: 2.5 V

The ability to operate at a low voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 85 °C

The product can operate in high-temperature environments without compromising performance or reliability.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high-performance capabilities, making this product energy-efficient and reliable.

Minimum Operating Temperature: -40 °C

The product can withstand extremely low temperatures, making it suitable for use in harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish ensures good conductivity and corrosion resistance, improving the product's reliability and longevity.

ADC Channels: YES

Analog-to-digital converters enable the product to convert external analog signals into digital data, expanding its versatility.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, making the product easier to integrate into a design.

Technical Specifications

Microcontrollers MSP430F477IZCAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Serial I/Os:

1

No. of Terminals:

113

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Maximum Supply Current:

.46 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BROWN-OUT DETECTOR, COMPARATOR, LCD, RTC, TIMER(2), WDT

Analog To Digital Convertors:

5-Ch 16-Bit

Digital To Analog Convertors:

1-Ch 12-bit

Trade Compliance

MSP430F477IZCAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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